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ASTM B563 Pd-Ag-Cu vs. Solder Alloy 704

Both ASTM B563 Pd-Ag-Cu and solder alloy 704 are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is ASTM B563 Pd-Ag-Cu and the bottom bar is solder alloy 704.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
51
Elongation at Break, % 7.0 to 17
30
Poisson's Ratio 0.37
0.36
Shear Modulus, GPa 37
19
Tensile Strength: Ultimate (UTS), MPa 760 to 1170
55

Thermal Properties

Latent Heat of Fusion, J/g 150
62
Melting Completion (Liquidus), °C 1180
240
Melting Onset (Solidus), °C 1030
220
Specific Heat Capacity, J/kg-K 260
220
Thermal Expansion, µm/m-K 14
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.6 to 6.7
13
Electrical Conductivity: Equal Weight (Specific), % IACS 4.6 to 5.5
15

Otherwise Unclassified Properties

Density, g/cm3 11
7.5

Common Calculations

Stiffness to Weight: Axial, points 5.2
3.8
Stiffness to Weight: Bending, points 14
17
Strength to Weight: Axial, points 19 to 30
2.1
Strength to Weight: Bending, points 17 to 22
4.3
Thermal Shock Resistance, points 39 to 61
3.5

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 15.5 to 16.5
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0.8 to 1.2
0 to 0.010
Palladium (Pd), % 43 to 45
0
Platinum (Pt), % 0.8 to 1.2
0
Silver (Ag), % 37 to 39
4.8 to 5.2
Tin (Sn), % 0
94.3 to 95.2
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.4
0