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ASTM B596 Au-Cu vs. Solder Alloy 701

Both ASTM B596 Au-Cu and solder alloy 701 are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown. Please note that the two materials have significantly dissimilar densities. This means that additional care is required when interpreting the data, because some material properties are based on units of mass, while others are based on units of area or volume.

For each property being compared, the top bar is ASTM B596 Au-Cu and the bottom bar is solder alloy 701.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
51
Elongation at Break, % 4.3 to 17
37
Poisson's Ratio 0.41
0.36
Shear Modulus, GPa 36
19
Tensile Strength: Ultimate (UTS), MPa 450 to 620
54

Thermal Properties

Latent Heat of Fusion, J/g 77
61
Melting Completion (Liquidus), °C 1060
230
Melting Onset (Solidus), °C 930
220
Specific Heat Capacity, J/kg-K 150
220
Thermal Expansion, µm/m-K 14
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
14
Electrical Conductivity: Equal Weight (Specific), % IACS 6.7
17

Otherwise Unclassified Properties

Density, g/cm3 18
7.4

Common Calculations

Stiffness to Weight: Axial, points 3.1
3.8
Stiffness to Weight: Bending, points 8.5
17
Strength to Weight: Axial, points 6.8 to 9.4
2.0
Strength to Weight: Bending, points 7.1 to 8.8
4.3
Thermal Shock Resistance, points 22 to 30
3.5

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 9.0 to 11
0 to 0.050
Gold (Au), % 89 to 91
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
3.5 to 3.9
Tin (Sn), % 0
95.6 to 96.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.4
0