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ASTM B685 Alloy vs. C82500 Copper

ASTM B685 alloy belongs to the otherwise unclassified metals classification, while C82500 copper belongs to the copper alloys. They have 40% of their average alloy composition in common. There are 17 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is ASTM B685 alloy and the bottom bar is C82500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Poisson's Ratio 0.37
0.33
Shear Modulus, GPa 43
45
Tensile Strength: Ultimate (UTS), MPa 660 to 1060
550 to 1100

Thermal Properties

Latent Heat of Fusion, J/g 180
240
Melting Completion (Liquidus), °C 1230
980
Melting Onset (Solidus), °C 1200
860
Specific Heat Capacity, J/kg-K 300
390
Thermal Expansion, µm/m-K 14
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.0
20
Electrical Conductivity: Equal Weight (Specific), % IACS 4.1
21

Otherwise Unclassified Properties

Density, g/cm3 11
8.8

Common Calculations

Stiffness to Weight: Axial, points 6.1
7.7
Stiffness to Weight: Bending, points 15
19
Strength to Weight: Axial, points 17 to 27
18 to 35
Strength to Weight: Bending, points 16 to 21
17 to 27
Thermal Shock Resistance, points 28 to 46
19 to 38

Alloy Composition


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Aluminum (Al), % 0 to 0.0050
0 to 0.15
Beryllium (Be), % 0
1.9 to 2.3
Cadmium (Cd), % 0 to 0.050
0
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
0.15 to 0.7
Copper (Cu), % 39.5 to 40.5
95.3 to 97.8
Iron (Fe), % 0 to 0.050
0 to 0.25
Lead (Pb), % 0 to 0.030
0 to 0.020
Nickel (Ni), % 0
0 to 0.2
Palladium (Pd), % 59 to 60.5
0
Silicon (Si), % 0
0.2 to 0.35
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 0
0 to 0.1
Titanium (Ti), % 0
0 to 0.12
Zinc (Zn), % 0 to 0.060
0 to 0.1
Residuals, % 0 to 0.2
0 to 0.5