MakeItFrom.com
Menu (ESC)

ASTM Grade HF Steel vs. C16200 Copper

ASTM grade HF steel belongs to the iron alloys classification, while C16200 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is ASTM grade HF steel and the bottom bar is C16200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 200
120
Elongation at Break, % 29
2.0 to 56
Fatigue Strength, MPa 200
100 to 210
Poisson's Ratio 0.28
0.34
Shear Modulus, GPa 77
43
Tensile Strength: Ultimate (UTS), MPa 550
240 to 550
Tensile Strength: Yield (Proof), MPa 270
48 to 470

Thermal Properties

Latent Heat of Fusion, J/g 300
210
Maximum Temperature: Mechanical, °C 1000
370
Melting Completion (Liquidus), °C 1410
1080
Melting Onset (Solidus), °C 1370
1030
Specific Heat Capacity, J/kg-K 480
380
Thermal Conductivity, W/m-K 16
360
Thermal Expansion, µm/m-K 16
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 2.1
90
Electrical Conductivity: Equal Weight (Specific), % IACS 2.4
90

Otherwise Unclassified Properties

Base Metal Price, % relative 17
30
Density, g/cm3 7.7
9.0
Embodied Carbon, kg CO2/kg material 3.2
2.6
Embodied Energy, MJ/kg 46
41
Embodied Water, L/kg 150
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 130
10 to 99
Resilience: Unit (Modulus of Resilience), kJ/m3 180
10 to 970
Stiffness to Weight: Axial, points 14
7.2
Stiffness to Weight: Bending, points 25
18
Strength to Weight: Axial, points 20
7.4 to 17
Strength to Weight: Bending, points 19
9.6 to 17
Thermal Diffusivity, mm2/s 4.2
100
Thermal Shock Resistance, points 12
8.7 to 20

Alloy Composition

Cadmium (Cd), % 0
0.7 to 1.2
Carbon (C), % 0.2 to 0.4
0
Chromium (Cr), % 18 to 23
0
Copper (Cu), % 0
98.6 to 99.3
Iron (Fe), % 60 to 73.8
0 to 0.2
Manganese (Mn), % 0 to 2.0
0
Molybdenum (Mo), % 0 to 0.5
0
Nickel (Ni), % 8.0 to 12
0
Phosphorus (P), % 0 to 0.040
0
Silicon (Si), % 0 to 2.0
0
Sulfur (S), % 0 to 0.040
0