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ASTM Grade HK Steel vs. C17500 Copper

ASTM grade HK steel belongs to the iron alloys classification, while C17500 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is ASTM grade HK steel and the bottom bar is C17500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 200
120
Elongation at Break, % 11
6.0 to 30
Fatigue Strength, MPa 150
170 to 310
Poisson's Ratio 0.27
0.34
Shear Modulus, GPa 79
45
Tensile Strength: Ultimate (UTS), MPa 500
310 to 860
Tensile Strength: Yield (Proof), MPa 270
170 to 760

Thermal Properties

Latent Heat of Fusion, J/g 310
220
Maximum Temperature: Mechanical, °C 1100
220
Melting Completion (Liquidus), °C 1400
1060
Melting Onset (Solidus), °C 1350
1020
Specific Heat Capacity, J/kg-K 480
390
Thermal Conductivity, W/m-K 15
200
Thermal Expansion, µm/m-K 17
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 2.0
24 to 53
Electrical Conductivity: Equal Weight (Specific), % IACS 2.3
24 to 54

Otherwise Unclassified Properties

Base Metal Price, % relative 25
60
Density, g/cm3 7.8
8.9
Embodied Carbon, kg CO2/kg material 4.4
4.7
Embodied Energy, MJ/kg 63
73
Embodied Water, L/kg 200
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 48
30 to 120
Resilience: Unit (Modulus of Resilience), kJ/m3 190
120 to 2390
Stiffness to Weight: Axial, points 14
7.5
Stiffness to Weight: Bending, points 25
18
Strength to Weight: Axial, points 18
9.7 to 27
Strength to Weight: Bending, points 18
11 to 23
Thermal Diffusivity, mm2/s 3.9
59
Thermal Shock Resistance, points 11
11 to 29

Alloy Composition


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Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
0.4 to 0.7
Carbon (C), % 0.2 to 0.6
0
Chromium (Cr), % 24 to 28
0
Cobalt (Co), % 0
2.4 to 2.7
Copper (Cu), % 0
95.6 to 97.2
Iron (Fe), % 44.8 to 57.8
0 to 0.1
Manganese (Mn), % 0 to 2.0
0
Molybdenum (Mo), % 0 to 0.5
0
Nickel (Ni), % 18 to 22
0
Phosphorus (P), % 0 to 0.040
0
Silicon (Si), % 0 to 2.0
0 to 0.2
Sulfur (S), % 0 to 0.040
0
Residuals, % 0
0 to 0.5