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ASTM Grade HT Steel vs. ASTM Grade LC2-1 Steel

Both ASTM grade HT steel and ASTM grade LC2-1 steel are iron alloys. They have 51% of their average alloy composition in common. There are 31 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is ASTM grade HT steel and the bottom bar is ASTM grade LC2-1 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 150
240
Elastic (Young's, Tensile) Modulus, GPa 190
190
Elongation at Break, % 4.6
20
Fatigue Strength, MPa 130
430
Poisson's Ratio 0.28
0.29
Shear Modulus, GPa 76
73
Tensile Strength: Ultimate (UTS), MPa 500
810
Tensile Strength: Yield (Proof), MPa 270
630

Thermal Properties

Latent Heat of Fusion, J/g 310
260
Maximum Temperature: Mechanical, °C 1010
450
Melting Completion (Liquidus), °C 1390
1460
Melting Onset (Solidus), °C 1340
1420
Specific Heat Capacity, J/kg-K 480
470
Thermal Conductivity, W/m-K 12
46
Thermal Expansion, µm/m-K 15
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.7
8.0
Electrical Conductivity: Equal Weight (Specific), % IACS 1.9
9.1

Otherwise Unclassified Properties

Base Metal Price, % relative 31
5.0
Density, g/cm3 8.0
7.9
Embodied Carbon, kg CO2/kg material 5.4
1.9
Embodied Energy, MJ/kg 76
25
Embodied Water, L/kg 190
60

Common Calculations

PREN (Pitting Resistance) 18
3.1
Resilience: Ultimate (Unit Rupture Work), MJ/m3 19
150
Resilience: Unit (Modulus of Resilience), kJ/m3 180
1040
Stiffness to Weight: Axial, points 13
13
Stiffness to Weight: Bending, points 24
24
Strength to Weight: Axial, points 18
29
Strength to Weight: Bending, points 18
25
Thermal Diffusivity, mm2/s 3.2
12
Thermal Shock Resistance, points 12
24

Alloy Composition

Carbon (C), % 0.35 to 0.75
0 to 0.22
Chromium (Cr), % 15 to 19
1.4 to 1.9
Iron (Fe), % 38.2 to 51.7
92.5 to 95.3
Manganese (Mn), % 0 to 2.0
0.55 to 0.75
Molybdenum (Mo), % 0 to 0.5
0.3 to 0.6
Nickel (Ni), % 33 to 37
2.5 to 3.5
Phosphorus (P), % 0 to 0.040
0 to 0.040
Silicon (Si), % 0 to 2.5
0 to 0.5
Sulfur (S), % 0 to 0.040
0 to 0.045