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AWS E309H vs. Solder Alloy 703

AWS E309H belongs to the iron alloys classification, while solder alloy 703 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is AWS E309H and the bottom bar is solder alloy 703.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 200
51
Elongation at Break, % 34
35
Poisson's Ratio 0.27
0.36
Shear Modulus, GPa 78
19
Tensile Strength: Ultimate (UTS), MPa 620
57

Thermal Properties

Latent Heat of Fusion, J/g 300
61
Melting Completion (Liquidus), °C 1410
220
Melting Onset (Solidus), °C 1370
220
Specific Heat Capacity, J/kg-K 480
220
Thermal Conductivity, W/m-K 15
55
Thermal Expansion, µm/m-K 14
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 2.1
14
Electrical Conductivity: Equal Weight (Specific), % IACS 2.5
17

Otherwise Unclassified Properties

Density, g/cm3 7.8
7.4
Embodied Carbon, kg CO2/kg material 3.7
18
Embodied Energy, MJ/kg 52
300

Common Calculations

Stiffness to Weight: Axial, points 14
3.8
Stiffness to Weight: Bending, points 25
17
Strength to Weight: Axial, points 22
2.1
Strength to Weight: Bending, points 21
4.4
Thermal Diffusivity, mm2/s 4.0
33
Thermal Shock Resistance, points 16
3.7

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0.040 to 0.15
0
Chromium (Cr), % 22 to 25
0
Copper (Cu), % 0 to 0.75
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 55.8 to 65.5
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Manganese (Mn), % 0.5 to 2.5
0
Molybdenum (Mo), % 0 to 0.75
0
Nickel (Ni), % 12 to 14
0 to 0.010
Phosphorus (P), % 0 to 0.040
0
Silicon (Si), % 0 to 1.0
0
Silver (Ag), % 0
3.3 to 3.7
Sulfur (S), % 0 to 0.030
0
Tin (Sn), % 0
95.8 to 96.7
Zinc (Zn), % 0
0 to 0.0010