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TB00 C17500 Copper vs. TB00 C17510 Copper

Both TB00 C17500 copper and TB00 C17510 copper are copper alloys. Both are furnished in the TB00 (solution heat treated) temper. They have a very high 97% of their average alloy composition in common. There are 30 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is TB00 C17500 copper and the bottom bar is TB00 C17510 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 30
37
Poisson's Ratio 0.34
0.34
Rockwell B Hardness 38
44
Shear Modulus, GPa 45
44
Shear Strength, MPa 200
210
Tensile Strength: Ultimate (UTS), MPa 310
310
Tensile Strength: Yield (Proof), MPa 170
120

Thermal Properties

Latent Heat of Fusion, J/g 220
220
Maximum Temperature: Mechanical, °C 220
220
Melting Completion (Liquidus), °C 1060
1070
Melting Onset (Solidus), °C 1020
1030
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 200
210
Thermal Expansion, µm/m-K 18
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 24
23
Electrical Conductivity: Equal Weight (Specific), % IACS 24
23

Otherwise Unclassified Properties

Base Metal Price, % relative 60
49
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 4.7
4.2
Embodied Energy, MJ/kg 73
65
Embodied Water, L/kg 320
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 79
92
Resilience: Unit (Modulus of Resilience), kJ/m3 120
64
Stiffness to Weight: Axial, points 7.5
7.4
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 9.7
9.7
Strength to Weight: Bending, points 11
11
Thermal Diffusivity, mm2/s 59
60
Thermal Shock Resistance, points 11
11

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0 to 0.2
Beryllium (Be), % 0.4 to 0.7
0.2 to 0.6
Cobalt (Co), % 2.4 to 2.7
0 to 0.3
Copper (Cu), % 95.6 to 97.2
95.9 to 98.4
Iron (Fe), % 0 to 0.1
0 to 0.1
Nickel (Ni), % 0
1.4 to 2.2
Silicon (Si), % 0 to 0.2
0 to 0.2
Residuals, % 0 to 0.5
0 to 0.5