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O61 C28000 Muntz Metal vs. O61 C49300 Brass

Both O61 C28000 Muntz Metal and O61 C49300 brass are copper alloys. Both are furnished in the O61 (annealed) temper. They have a very high 96% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is O61 C28000 Muntz Metal and the bottom bar is O61 C49300 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
100
Elongation at Break, % 45
18
Poisson's Ratio 0.31
0.31
Shear Modulus, GPa 40
40
Shear Strength, MPa 280
270
Tensile Strength: Ultimate (UTS), MPa 380
440
Tensile Strength: Yield (Proof), MPa 150
280

Thermal Properties

Latent Heat of Fusion, J/g 170
170
Maximum Temperature: Mechanical, °C 120
120
Melting Completion (Liquidus), °C 900
880
Melting Onset (Solidus), °C 900
840
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 120
88
Thermal Expansion, µm/m-K 21
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 28
15
Electrical Conductivity: Equal Weight (Specific), % IACS 31
17

Otherwise Unclassified Properties

Base Metal Price, % relative 23
26
Density, g/cm3 8.0
8.0
Embodied Carbon, kg CO2/kg material 2.7
3.0
Embodied Energy, MJ/kg 46
50
Embodied Water, L/kg 320
370

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 140
70
Resilience: Unit (Modulus of Resilience), kJ/m3 110
390
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 13
15
Strength to Weight: Bending, points 15
16
Thermal Diffusivity, mm2/s 40
29
Thermal Shock Resistance, points 12
15

Alloy Composition


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Aluminum (Al), % 0
0 to 0.5
Antimony (Sb), % 0
0 to 0.5
Bismuth (Bi), % 0
0.5 to 2.0
Copper (Cu), % 59 to 63
58 to 62
Iron (Fe), % 0 to 0.070
0 to 0.1
Lead (Pb), % 0 to 0.3
0 to 0.010
Manganese (Mn), % 0
0 to 0.030
Nickel (Ni), % 0
0 to 1.5
Phosphorus (P), % 0
0 to 0.2
Selenium (Se), % 0
0 to 0.2
Silicon (Si), % 0
0 to 0.1
Tin (Sn), % 0
1.0 to 1.8
Zinc (Zn), % 36.3 to 41
30.6 to 40.5
Residuals, % 0 to 0.3
0 to 0.5