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EN 2.4889 Nickel vs. C16500 Copper

EN 2.4889 nickel belongs to the nickel alloys classification, while C16500 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is EN 2.4889 nickel and the bottom bar is C16500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 200
110
Elongation at Break, % 39
1.5 to 53
Poisson's Ratio 0.28
0.34
Shear Modulus, GPa 77
43
Shear Strength, MPa 490
200 to 310
Tensile Strength: Ultimate (UTS), MPa 720
280 to 530
Tensile Strength: Yield (Proof), MPa 270
97 to 520

Thermal Properties

Latent Heat of Fusion, J/g 350
210
Maximum Temperature: Mechanical, °C 1200
340
Melting Completion (Liquidus), °C 1350
1070
Melting Onset (Solidus), °C 1300
1010
Specific Heat Capacity, J/kg-K 480
380
Thermal Conductivity, W/m-K 13
250
Thermal Expansion, µm/m-K 14
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.5
60
Electrical Conductivity: Equal Weight (Specific), % IACS 1.6
61

Otherwise Unclassified Properties

Base Metal Price, % relative 42
31
Density, g/cm3 8.0
8.9
Embodied Carbon, kg CO2/kg material 6.9
2.6
Embodied Energy, MJ/kg 98
42
Embodied Water, L/kg 250
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 220
7.8 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 180
41 to 1160
Stiffness to Weight: Axial, points 14
7.1
Stiffness to Weight: Bending, points 24
18
Strength to Weight: Axial, points 25
8.6 to 17
Strength to Weight: Bending, points 22
11 to 16
Thermal Diffusivity, mm2/s 3.4
74
Thermal Shock Resistance, points 19
9.8 to 19

Alloy Composition


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Cadmium (Cd), % 0
0.6 to 1.0
Carbon (C), % 0.050 to 0.12
0
Cerium (Ce), % 0.030 to 0.090
0
Chromium (Cr), % 26 to 29
0
Copper (Cu), % 0 to 0.3
97.8 to 98.9
Iron (Fe), % 21 to 25
0 to 0.020
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 45 to 50.4
0
Phosphorus (P), % 0 to 0.020
0
Silicon (Si), % 2.5 to 3.0
0
Sulfur (S), % 0 to 0.010
0
Tin (Sn), % 0
0.5 to 0.7
Residuals, % 0
0 to 0.5