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CC381H Copper-nickel vs. Solder Alloy 301

CC381H copper-nickel belongs to the copper alloys classification, while solder alloy 301 belongs to the otherwise unclassified metals. There are 26 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is CC381H copper-nickel and the bottom bar is solder alloy 301.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 91
23
Elastic (Young's, Tensile) Modulus, GPa 140
40
Elongation at Break, % 20
51
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 52
15
Tensile Strength: Ultimate (UTS), MPa 380
55
Tensile Strength: Yield (Proof), MPa 140
49

Thermal Properties

Latent Heat of Fusion, J/g 240
55
Melting Completion (Liquidus), °C 1180
140
Melting Onset (Solidus), °C 1120
140
Specific Heat Capacity, J/kg-K 410
160
Thermal Conductivity, W/m-K 30
19
Thermal Expansion, µm/m-K 16
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.8
4.7
Electrical Conductivity: Equal Weight (Specific), % IACS 6.9
4.9

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.7
Embodied Carbon, kg CO2/kg material 5.0
13
Embodied Energy, MJ/kg 73
210

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 60
27
Resilience: Unit (Modulus of Resilience), kJ/m3 68
30
Stiffness to Weight: Axial, points 8.6
2.5
Stiffness to Weight: Bending, points 19
13
Strength to Weight: Axial, points 12
1.8
Strength to Weight: Bending, points 13
3.7
Thermal Diffusivity, mm2/s 8.4
13
Thermal Shock Resistance, points 13
7.2

Alloy Composition

Aluminum (Al), % 0 to 0.010
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
56.5 to 59
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64.5 to 69.9
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.5 to 1.5
0 to 0.020
Lead (Pb), % 0 to 0.030
0 to 0.070
Manganese (Mn), % 0.6 to 1.2
0
Nickel (Ni), % 29 to 31
0 to 0.010
Phosphorus (P), % 0 to 0.010
0
Silicon (Si), % 0 to 0.1
0
Silver (Ag), % 0
0 to 0.1
Sulfur (S), % 0 to 0.010
0
Tin (Sn), % 0
41 to 43
Zinc (Zn), % 0 to 0.5
0 to 0.0010