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CC381H Copper-nickel vs. C90500 Gun Metal

Both CC381H copper-nickel and C90500 gun metal are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 68% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is CC381H copper-nickel and the bottom bar is C90500 gun metal.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
20
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 52
40
Tensile Strength: Ultimate (UTS), MPa 380
320
Tensile Strength: Yield (Proof), MPa 140
160

Thermal Properties

Latent Heat of Fusion, J/g 240
190
Maximum Temperature: Mechanical, °C 260
170
Melting Completion (Liquidus), °C 1180
1000
Melting Onset (Solidus), °C 1120
850
Specific Heat Capacity, J/kg-K 410
370
Thermal Conductivity, W/m-K 30
75
Thermal Expansion, µm/m-K 16
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.8
11
Electrical Conductivity: Equal Weight (Specific), % IACS 6.9
11

Otherwise Unclassified Properties

Base Metal Price, % relative 40
35
Density, g/cm3 8.9
8.7
Embodied Carbon, kg CO2/kg material 5.0
3.6
Embodied Energy, MJ/kg 73
59
Embodied Water, L/kg 280
390

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 60
54
Resilience: Unit (Modulus of Resilience), kJ/m3 68
110
Stiffness to Weight: Axial, points 8.6
6.9
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 12
10
Strength to Weight: Bending, points 13
12
Thermal Diffusivity, mm2/s 8.4
23
Thermal Shock Resistance, points 13
12

Alloy Composition


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Aluminum (Al), % 0 to 0.010
0 to 0.0050
Antimony (Sb), % 0
0 to 0.2
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64.5 to 69.9
86 to 89
Iron (Fe), % 0.5 to 1.5
0 to 0.2
Lead (Pb), % 0 to 0.030
0 to 0.3
Manganese (Mn), % 0.6 to 1.2
0
Nickel (Ni), % 29 to 31
0 to 1.0
Phosphorus (P), % 0 to 0.010
0 to 1.5
Silicon (Si), % 0 to 0.1
0 to 0.0050
Sulfur (S), % 0 to 0.010
0 to 0.050
Tin (Sn), % 0
9.0 to 11
Zinc (Zn), % 0 to 0.5
1.0 to 3.0
Residuals, % 0
0 to 0.3