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CC382H Copper-nickel vs. C23000 Brass

Both CC382H copper-nickel and C23000 brass are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is CC382H copper-nickel and the bottom bar is C23000 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
2.9 to 47
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 53
42
Tensile Strength: Ultimate (UTS), MPa 490
280 to 590
Tensile Strength: Yield (Proof), MPa 290
83 to 480

Thermal Properties

Latent Heat of Fusion, J/g 240
190
Maximum Temperature: Mechanical, °C 260
170
Melting Completion (Liquidus), °C 1180
1030
Melting Onset (Solidus), °C 1120
990
Specific Heat Capacity, J/kg-K 410
390
Thermal Conductivity, W/m-K 30
160
Thermal Expansion, µm/m-K 15
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.5
37
Electrical Conductivity: Equal Weight (Specific), % IACS 5.6
39

Otherwise Unclassified Properties

Base Metal Price, % relative 41
28
Density, g/cm3 8.9
8.6
Embodied Carbon, kg CO2/kg material 5.2
2.6
Embodied Energy, MJ/kg 76
43
Embodied Water, L/kg 290
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 85
6.2 to 260
Resilience: Unit (Modulus of Resilience), kJ/m3 290
31 to 1040
Stiffness to Weight: Axial, points 8.8
7.2
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 15
8.9 to 19
Strength to Weight: Bending, points 16
11 to 18
Thermal Diffusivity, mm2/s 8.2
48
Thermal Shock Resistance, points 16
9.4 to 20

Alloy Composition


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Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.0020
0
Boron (B), % 0 to 0.010
0
Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 1.5 to 2.0
0
Copper (Cu), % 62.8 to 68.4
84 to 86
Iron (Fe), % 0.5 to 1.0
0 to 0.050
Lead (Pb), % 0 to 0.0050
0 to 0.050
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.5 to 1.0
0
Nickel (Ni), % 29 to 32
0
Phosphorus (P), % 0 to 0.010
0
Selenium (Se), % 0 to 0.0050
0
Silicon (Si), % 0.15 to 0.5
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.0050
0
Titanium (Ti), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.2
13.7 to 16
Zirconium (Zr), % 0 to 0.15
0
Residuals, % 0
0 to 0.2