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CC382H Copper-nickel vs. C42600 Brass

Both CC382H copper-nickel and C42600 brass are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is CC382H copper-nickel and the bottom bar is C42600 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
1.1 to 40
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 53
42
Tensile Strength: Ultimate (UTS), MPa 490
410 to 830
Tensile Strength: Yield (Proof), MPa 290
220 to 810

Thermal Properties

Latent Heat of Fusion, J/g 240
200
Maximum Temperature: Mechanical, °C 260
180
Melting Completion (Liquidus), °C 1180
1030
Melting Onset (Solidus), °C 1120
1010
Specific Heat Capacity, J/kg-K 410
380
Thermal Conductivity, W/m-K 30
110
Thermal Expansion, µm/m-K 15
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.5
25
Electrical Conductivity: Equal Weight (Specific), % IACS 5.6
26

Otherwise Unclassified Properties

Base Metal Price, % relative 41
31
Density, g/cm3 8.9
8.7
Embodied Carbon, kg CO2/kg material 5.2
2.9
Embodied Energy, MJ/kg 76
48
Embodied Water, L/kg 290
340

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 85
9.4 to 140
Resilience: Unit (Modulus of Resilience), kJ/m3 290
230 to 2970
Stiffness to Weight: Axial, points 8.8
7.1
Stiffness to Weight: Bending, points 20
18
Strength to Weight: Axial, points 15
13 to 27
Strength to Weight: Bending, points 16
14 to 23
Thermal Diffusivity, mm2/s 8.2
33
Thermal Shock Resistance, points 16
15 to 29

Alloy Composition


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Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.0020
0
Boron (B), % 0 to 0.010
0
Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 1.5 to 2.0
0
Copper (Cu), % 62.8 to 68.4
87 to 90
Iron (Fe), % 0.5 to 1.0
0.050 to 0.2
Lead (Pb), % 0 to 0.0050
0 to 0.050
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.5 to 1.0
0
Nickel (Ni), % 29 to 32
0.050 to 0.2
Phosphorus (P), % 0 to 0.010
0.020 to 0.050
Selenium (Se), % 0 to 0.0050
0
Silicon (Si), % 0.15 to 0.5
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.0050
0
Tin (Sn), % 0
2.5 to 4.0
Titanium (Ti), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.2
5.3 to 10.4
Zirconium (Zr), % 0 to 0.15
0
Residuals, % 0
0 to 0.2