CC383H Copper-nickel vs. AWS BAu-6
CC383H copper-nickel belongs to the copper alloys classification, while AWS BAu-6 belongs to the otherwise unclassified metals. They have a modest 22% of their average alloy composition in common, which, by itself, doesn't mean much. There are 15 material properties with values for both materials. Properties with values for just one material (15, in this case) are not shown.
For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is AWS BAu-6.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 140 | |
| 120 |
| Poisson's Ratio | 0.33 | |
| 0.39 |
| Shear Modulus, GPa | 52 | |
| 43 |
| Tensile Strength: Ultimate (UTS), MPa | 490 | |
| 190 |
Thermal Properties
| Latent Heat of Fusion, J/g | 240 | |
| 120 |
| Melting Completion (Liquidus), °C | 1180 | |
| 1050 |
| Melting Onset (Solidus), °C | 1130 | |
| 1010 |
| Specific Heat Capacity, J/kg-K | 410 | |
| 210 |
| Thermal Expansion, µm/m-K | 15 | |
| 13 |
Otherwise Unclassified Properties
| Density, g/cm3 | 8.9 | |
| 16 |
Common Calculations
| Stiffness to Weight: Axial, points | 8.6 | |
| 4.0 |
| Stiffness to Weight: Bending, points | 19 | |
| 10 |
| Strength to Weight: Axial, points | 15 | |
| 3.2 |
| Strength to Weight: Bending, points | 16 | |
| 4.5 |
| Thermal Shock Resistance, points | 17 | |
| 8.5 |
Alloy Composition
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| Aluminum (Al), % | 0 to 0.010 | |
| 0 |
| Bismuth (Bi), % | 0 to 0.010 | |
| 0 |
| Boron (B), % | 0 to 0.010 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.020 | |
| 0 |
| Carbon (C), % | 0 to 0.030 | |
| 0 |
| Copper (Cu), % | 64 to 69.1 | |
| 0 |
| Gold (Au), % | 0 | |
| 69.5 to 70.5 |
| Iron (Fe), % | 0.5 to 1.5 | |
| 0 |
| Lead (Pb), % | 0 to 0.010 | |
| 0 |
| Magnesium (Mg), % | 0 to 0.010 | |
| 0 |
| Manganese (Mn), % | 0.6 to 1.2 | |
| 0 |
| Nickel (Ni), % | 29 to 31 | |
| 21.5 to 22.5 |
| Niobium (Nb), % | 0.5 to 1.0 | |
| 0 |
| Palladium (Pd), % | 0 | |
| 7.5 to 8.5 |
| Phosphorus (P), % | 0 to 0.010 | |
| 0 |
| Selenium (Se), % | 0 to 0.010 | |
| 0 |
| Silicon (Si), % | 0.3 to 0.7 | |
| 0 |
| Sulfur (S), % | 0 to 0.010 | |
| 0 |
| Tellurium (Te), % | 0 to 0.010 | |
| 0 |
| Zinc (Zn), % | 0 to 0.5 | |
| 0 |
| Residuals, % | 0 | |
| 0 to 0.15 |