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CC383H Copper-nickel vs. CC330G Bronze

Both CC383H copper-nickel and CC330G bronze are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 68% of their average alloy composition in common.

For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is CC330G bronze.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 130
110
Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
20
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 52
42
Tensile Strength: Ultimate (UTS), MPa 490
530
Tensile Strength: Yield (Proof), MPa 260
190

Thermal Properties

Latent Heat of Fusion, J/g 240
230
Maximum Temperature: Mechanical, °C 260
220
Melting Completion (Liquidus), °C 1180
1050
Melting Onset (Solidus), °C 1130
1000
Specific Heat Capacity, J/kg-K 410
430
Thermal Conductivity, W/m-K 29
62
Thermal Expansion, µm/m-K 15
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.2
14
Electrical Conductivity: Equal Weight (Specific), % IACS 5.3
15

Otherwise Unclassified Properties

Base Metal Price, % relative 44
29
Density, g/cm3 8.9
8.4
Embodied Carbon, kg CO2/kg material 5.7
3.2
Embodied Energy, MJ/kg 83
52
Embodied Water, L/kg 280
390

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 84
82
Resilience: Unit (Modulus of Resilience), kJ/m3 250
170
Stiffness to Weight: Axial, points 8.6
7.5
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 15
18
Strength to Weight: Bending, points 16
17
Thermal Diffusivity, mm2/s 8.1
17
Thermal Shock Resistance, points 17
19

Alloy Composition

Aluminum (Al), % 0 to 0.010
8.0 to 10.5
Bismuth (Bi), % 0 to 0.010
0
Boron (B), % 0 to 0.010
0
Cadmium (Cd), % 0 to 0.020
0
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64 to 69.1
87 to 92
Iron (Fe), % 0.5 to 1.5
0 to 1.2
Lead (Pb), % 0 to 0.010
0 to 0.3
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.6 to 1.2
0 to 0.5
Nickel (Ni), % 29 to 31
0 to 1.0
Niobium (Nb), % 0.5 to 1.0
0
Phosphorus (P), % 0 to 0.010
0
Selenium (Se), % 0 to 0.010
0
Silicon (Si), % 0.3 to 0.7
0 to 0.2
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.010
0
Tin (Sn), % 0
0 to 0.3
Zinc (Zn), % 0 to 0.5
0 to 0.5