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CC383H Copper-nickel vs. Solder Alloy 704

CC383H copper-nickel belongs to the copper alloys classification, while solder alloy 704 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is solder alloy 704.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 130
14
Elastic (Young's, Tensile) Modulus, GPa 140
51
Elongation at Break, % 20
30
Poisson's Ratio 0.33
0.36
Shear Modulus, GPa 52
19
Tensile Strength: Ultimate (UTS), MPa 490
55

Thermal Properties

Latent Heat of Fusion, J/g 240
62
Melting Completion (Liquidus), °C 1180
240
Melting Onset (Solidus), °C 1130
220
Specific Heat Capacity, J/kg-K 410
220
Thermal Conductivity, W/m-K 29
50
Thermal Expansion, µm/m-K 15
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.2
13
Electrical Conductivity: Equal Weight (Specific), % IACS 5.3
15

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.5
Embodied Carbon, kg CO2/kg material 5.7
19
Embodied Energy, MJ/kg 83
320

Common Calculations

Stiffness to Weight: Axial, points 8.6
3.8
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 15
2.1
Strength to Weight: Bending, points 16
4.3
Thermal Diffusivity, mm2/s 8.1
30
Thermal Shock Resistance, points 17
3.5

Alloy Composition

Aluminum (Al), % 0 to 0.010
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0 to 0.010
0 to 0.1
Boron (B), % 0 to 0.010
0
Cadmium (Cd), % 0 to 0.020
0 to 0.0020
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64 to 69.1
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.5 to 1.5
0 to 0.020
Lead (Pb), % 0 to 0.010
0 to 0.070
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.6 to 1.2
0
Nickel (Ni), % 29 to 31
0 to 0.010
Niobium (Nb), % 0.5 to 1.0
0
Phosphorus (P), % 0 to 0.010
0
Selenium (Se), % 0 to 0.010
0
Silicon (Si), % 0.3 to 0.7
0
Silver (Ag), % 0
4.8 to 5.2
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.010
0
Tin (Sn), % 0
94.3 to 95.2
Zinc (Zn), % 0 to 0.5
0 to 0.0010