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CC383H Copper-nickel vs. C16500 Copper

Both CC383H copper-nickel and C16500 copper are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is C16500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
1.5 to 53
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 52
43
Tensile Strength: Ultimate (UTS), MPa 490
280 to 530
Tensile Strength: Yield (Proof), MPa 260
97 to 520

Thermal Properties

Latent Heat of Fusion, J/g 240
210
Maximum Temperature: Mechanical, °C 260
340
Melting Completion (Liquidus), °C 1180
1070
Melting Onset (Solidus), °C 1130
1010
Specific Heat Capacity, J/kg-K 410
380
Thermal Conductivity, W/m-K 29
250
Thermal Expansion, µm/m-K 15
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.2
60
Electrical Conductivity: Equal Weight (Specific), % IACS 5.3
61

Otherwise Unclassified Properties

Base Metal Price, % relative 44
31
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.7
2.6
Embodied Energy, MJ/kg 83
42
Embodied Water, L/kg 280
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 84
7.8 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 250
41 to 1160
Stiffness to Weight: Axial, points 8.6
7.1
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 15
8.6 to 17
Strength to Weight: Bending, points 16
11 to 16
Thermal Diffusivity, mm2/s 8.1
74
Thermal Shock Resistance, points 17
9.8 to 19

Alloy Composition


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Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.010
0
Boron (B), % 0 to 0.010
0
Cadmium (Cd), % 0 to 0.020
0.6 to 1.0
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64 to 69.1
97.8 to 98.9
Iron (Fe), % 0.5 to 1.5
0 to 0.020
Lead (Pb), % 0 to 0.010
0
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.6 to 1.2
0
Nickel (Ni), % 29 to 31
0
Niobium (Nb), % 0.5 to 1.0
0
Phosphorus (P), % 0 to 0.010
0
Selenium (Se), % 0 to 0.010
0
Silicon (Si), % 0.3 to 0.7
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.010
0
Tin (Sn), % 0
0.5 to 0.7
Zinc (Zn), % 0 to 0.5
0
Residuals, % 0
0 to 0.5