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CC383H Copper-nickel vs. C68800 Brass

Both CC383H copper-nickel and C68800 brass are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is C68800 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
2.0 to 36
Poisson's Ratio 0.33
0.32
Shear Modulus, GPa 52
41
Tensile Strength: Ultimate (UTS), MPa 490
570 to 890
Tensile Strength: Yield (Proof), MPa 260
390 to 790

Thermal Properties

Latent Heat of Fusion, J/g 240
190
Maximum Temperature: Mechanical, °C 260
160
Melting Completion (Liquidus), °C 1180
960
Melting Onset (Solidus), °C 1130
950
Specific Heat Capacity, J/kg-K 410
400
Thermal Conductivity, W/m-K 29
40
Thermal Expansion, µm/m-K 15
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.2
18
Electrical Conductivity: Equal Weight (Specific), % IACS 5.3
20

Otherwise Unclassified Properties

Base Metal Price, % relative 44
26
Density, g/cm3 8.9
8.2
Embodied Carbon, kg CO2/kg material 5.7
2.8
Embodied Energy, MJ/kg 83
48
Embodied Water, L/kg 280
350

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 84
16 to 180
Resilience: Unit (Modulus of Resilience), kJ/m3 250
710 to 2860
Stiffness to Weight: Axial, points 8.6
7.3
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 15
19 to 30
Strength to Weight: Bending, points 16
19 to 25
Thermal Diffusivity, mm2/s 8.1
12
Thermal Shock Resistance, points 17
19 to 30

Alloy Composition


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Aluminum (Al), % 0 to 0.010
3.0 to 3.8
Bismuth (Bi), % 0 to 0.010
0
Boron (B), % 0 to 0.010
0
Cadmium (Cd), % 0 to 0.020
0
Carbon (C), % 0 to 0.030
0
Cobalt (Co), % 0
0.25 to 0.55
Copper (Cu), % 64 to 69.1
70.8 to 75.5
Iron (Fe), % 0.5 to 1.5
0 to 0.2
Lead (Pb), % 0 to 0.010
0 to 0.050
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.6 to 1.2
0
Nickel (Ni), % 29 to 31
0
Niobium (Nb), % 0.5 to 1.0
0
Phosphorus (P), % 0 to 0.010
0
Selenium (Se), % 0 to 0.010
0
Silicon (Si), % 0.3 to 0.7
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.010
0
Zinc (Zn), % 0 to 0.5
21.3 to 24.1
Residuals, % 0
0 to 0.5