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CC383H Copper-nickel vs. C70260 Copper

Both CC383H copper-nickel and C70260 copper are copper alloys. They have 69% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is C70260 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
120
Elongation at Break, % 20
9.5 to 19
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 52
44
Tensile Strength: Ultimate (UTS), MPa 490
520 to 760
Tensile Strength: Yield (Proof), MPa 260
410 to 650

Thermal Properties

Latent Heat of Fusion, J/g 240
220
Maximum Temperature: Mechanical, °C 260
200
Melting Completion (Liquidus), °C 1180
1060
Melting Onset (Solidus), °C 1130
1040
Specific Heat Capacity, J/kg-K 410
390
Thermal Conductivity, W/m-K 29
160
Thermal Expansion, µm/m-K 15
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.2
40 to 50
Electrical Conductivity: Equal Weight (Specific), % IACS 5.3
40 to 51

Otherwise Unclassified Properties

Base Metal Price, % relative 44
31
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.7
2.7
Embodied Energy, MJ/kg 83
43
Embodied Water, L/kg 280
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 84
46 to 140
Resilience: Unit (Modulus of Resilience), kJ/m3 250
710 to 1810
Stiffness to Weight: Axial, points 8.6
7.3
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 15
16 to 24
Strength to Weight: Bending, points 16
16 to 21
Thermal Diffusivity, mm2/s 8.1
45
Thermal Shock Resistance, points 17
18 to 27

Alloy Composition


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Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.010
0
Boron (B), % 0 to 0.010
0
Cadmium (Cd), % 0 to 0.020
0
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64 to 69.1
95.8 to 98.8
Iron (Fe), % 0.5 to 1.5
0
Lead (Pb), % 0 to 0.010
0
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.6 to 1.2
0
Nickel (Ni), % 29 to 31
1.0 to 3.0
Niobium (Nb), % 0.5 to 1.0
0
Phosphorus (P), % 0 to 0.010
0 to 0.010
Selenium (Se), % 0 to 0.010
0
Silicon (Si), % 0.3 to 0.7
0.2 to 0.7
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.010
0
Zinc (Zn), % 0 to 0.5
0
Residuals, % 0
0 to 0.5