CC383H Copper-nickel vs. C72500 Copper-nickel
Both CC383H copper-nickel and C72500 copper-nickel are copper alloys. They have 77% of their average alloy composition in common. There are 24 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.
For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is C72500 copper-nickel.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 140 | |
| 120 |
| Poisson's Ratio | 0.33 | |
| 0.34 |
| Shear Modulus, GPa | 52 | |
| 45 |
| Tensile Strength: Ultimate (UTS), MPa | 490 | |
| 420 to 780 |
Thermal Properties
| Latent Heat of Fusion, J/g | 240 | |
| 210 |
| Maximum Temperature: Mechanical, °C | 260 | |
| 210 |
| Melting Completion (Liquidus), °C | 1180 | |
| 1130 |
| Melting Onset (Solidus), °C | 1130 | |
| 1060 |
| Specific Heat Capacity, J/kg-K | 410 | |
| 390 |
| Thermal Conductivity, W/m-K | 29 | |
| 54 |
| Thermal Expansion, µm/m-K | 15 | |
| 17 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 5.2 | |
| 11 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 5.3 | |
| 11 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 44 | |
| 35 |
| Density, g/cm3 | 8.9 | |
| 8.9 |
| Embodied Carbon, kg CO2/kg material | 5.7 | |
| 3.6 |
| Embodied Energy, MJ/kg | 83 | |
| 55 |
| Embodied Water, L/kg | 280 | |
| 320 |
Common Calculations
| Stiffness to Weight: Axial, points | 8.6 | |
| 7.6 |
| Stiffness to Weight: Bending, points | 19 | |
| 19 |
| Strength to Weight: Axial, points | 15 | |
| 13 to 24 |
| Strength to Weight: Bending, points | 16 | |
| 14 to 21 |
| Thermal Diffusivity, mm2/s | 8.1 | |
| 16 |
| Thermal Shock Resistance, points | 17 | |
| 14 to 27 |
Alloy Composition
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| Aluminum (Al), % | 0 to 0.010 | |
| 0 |
| Bismuth (Bi), % | 0 to 0.010 | |
| 0 |
| Boron (B), % | 0 to 0.010 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.020 | |
| 0 |
| Carbon (C), % | 0 to 0.030 | |
| 0 |
| Copper (Cu), % | 64 to 69.1 | |
| 85.2 to 89.7 |
| Iron (Fe), % | 0.5 to 1.5 | |
| 0 to 0.6 |
| Lead (Pb), % | 0 to 0.010 | |
| 0 to 0.050 |
| Magnesium (Mg), % | 0 to 0.010 | |
| 0 |
| Manganese (Mn), % | 0.6 to 1.2 | |
| 0 to 0.2 |
| Nickel (Ni), % | 29 to 31 | |
| 8.5 to 10.5 |
| Niobium (Nb), % | 0.5 to 1.0 | |
| 0 |
| Phosphorus (P), % | 0 to 0.010 | |
| 0 |
| Selenium (Se), % | 0 to 0.010 | |
| 0 |
| Silicon (Si), % | 0.3 to 0.7 | |
| 0 |
| Sulfur (S), % | 0 to 0.010 | |
| 0 |
| Tellurium (Te), % | 0 to 0.010 | |
| 0 |
| Tin (Sn), % | 0 | |
| 1.8 to 2.8 |
| Zinc (Zn), % | 0 to 0.5 | |
| 0 to 0.5 |
| Residuals, % | 0 | |
| 0 to 0.2 |