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CC383H Copper-nickel vs. C84100 Brass

Both CC383H copper-nickel and C84100 brass are copper alloys. They have 67% of their average alloy composition in common.

For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is C84100 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 130
65
Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
13
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 52
39
Tensile Strength: Ultimate (UTS), MPa 490
230
Tensile Strength: Yield (Proof), MPa 260
81

Thermal Properties

Latent Heat of Fusion, J/g 240
190
Maximum Temperature: Mechanical, °C 260
160
Melting Completion (Liquidus), °C 1180
1000
Melting Onset (Solidus), °C 1130
810
Specific Heat Capacity, J/kg-K 410
380
Thermal Conductivity, W/m-K 29
110
Thermal Expansion, µm/m-K 15
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.2
23
Electrical Conductivity: Equal Weight (Specific), % IACS 5.3
25

Otherwise Unclassified Properties

Base Metal Price, % relative 44
29
Density, g/cm3 8.9
8.5
Embodied Carbon, kg CO2/kg material 5.7
2.9
Embodied Energy, MJ/kg 83
48
Embodied Water, L/kg 280
340

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 84
24
Resilience: Unit (Modulus of Resilience), kJ/m3 250
30
Stiffness to Weight: Axial, points 8.6
7.1
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 15
7.4
Strength to Weight: Bending, points 16
9.7
Thermal Diffusivity, mm2/s 8.1
33
Thermal Shock Resistance, points 17
7.8

Alloy Composition


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Aluminum (Al), % 0 to 0.010
0 to 0.010
Antimony (Sb), % 0
0 to 0.050
Bismuth (Bi), % 0 to 0.010
0 to 0.090
Boron (B), % 0 to 0.010
0
Cadmium (Cd), % 0 to 0.020
0
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64 to 69.1
78 to 85
Iron (Fe), % 0.5 to 1.5
0 to 0.3
Lead (Pb), % 0 to 0.010
0.050 to 0.25
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.6 to 1.2
0
Nickel (Ni), % 29 to 31
0 to 0.5
Niobium (Nb), % 0.5 to 1.0
0
Phosphorus (P), % 0 to 0.010
0 to 0.050
Selenium (Se), % 0 to 0.010
0
Silicon (Si), % 0.3 to 0.7
0 to 0.010
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.010
0
Tin (Sn), % 0
1.5 to 4.5
Zinc (Zn), % 0 to 0.5
12 to 20
Residuals, % 0
0 to 0.5