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CC383H Copper-nickel vs. C96300 Copper-nickel

Both CC383H copper-nickel and C96300 copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 89% of their average alloy composition in common.

For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 130
150
Elastic (Young's, Tensile) Modulus, GPa 140
130
Elongation at Break, % 20
11
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 52
49
Tensile Strength: Ultimate (UTS), MPa 490
580
Tensile Strength: Yield (Proof), MPa 260
430

Thermal Properties

Latent Heat of Fusion, J/g 240
230
Maximum Temperature: Mechanical, °C 260
240
Melting Completion (Liquidus), °C 1180
1200
Melting Onset (Solidus), °C 1130
1150
Specific Heat Capacity, J/kg-K 410
400
Thermal Conductivity, W/m-K 29
37
Thermal Expansion, µm/m-K 15
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.2
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 5.3
6.1

Otherwise Unclassified Properties

Base Metal Price, % relative 44
42
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.7
5.1
Embodied Energy, MJ/kg 83
76
Embodied Water, L/kg 280
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 84
59
Resilience: Unit (Modulus of Resilience), kJ/m3 250
720
Stiffness to Weight: Axial, points 8.6
8.2
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 15
18
Strength to Weight: Bending, points 16
17
Thermal Diffusivity, mm2/s 8.1
10
Thermal Shock Resistance, points 17
20

Alloy Composition


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Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.010
0
Boron (B), % 0 to 0.010
0
Cadmium (Cd), % 0 to 0.020
0
Carbon (C), % 0 to 0.030
0 to 0.15
Copper (Cu), % 64 to 69.1
72.3 to 80.8
Iron (Fe), % 0.5 to 1.5
0.5 to 1.5
Lead (Pb), % 0 to 0.010
0 to 0.010
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.6 to 1.2
0.25 to 1.5
Nickel (Ni), % 29 to 31
18 to 22
Niobium (Nb), % 0.5 to 1.0
0.5 to 1.5
Phosphorus (P), % 0 to 0.010
0 to 0.020
Selenium (Se), % 0 to 0.010
0
Silicon (Si), % 0.3 to 0.7
0 to 0.5
Sulfur (S), % 0 to 0.010
0 to 0.020
Tellurium (Te), % 0 to 0.010
0
Zinc (Zn), % 0 to 0.5
0
Residuals, % 0
0 to 0.5