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CC751S Brass vs. Solder Alloy 801

CC751S brass belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is CC751S brass and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 130
22
Elastic (Young's, Tensile) Modulus, GPa 110
53
Elongation at Break, % 5.6
33
Poisson's Ratio 0.31
0.35
Shear Modulus, GPa 40
20
Tensile Strength: Ultimate (UTS), MPa 450
55

Thermal Properties

Latent Heat of Fusion, J/g 190
64
Melting Completion (Liquidus), °C 850
200
Melting Onset (Solidus), °C 810
200
Specific Heat Capacity, J/kg-K 390
240
Thermal Conductivity, W/m-K 110
61
Thermal Expansion, µm/m-K 20
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 25
15
Electrical Conductivity: Equal Weight (Specific), % IACS 28
19

Otherwise Unclassified Properties

Density, g/cm3 8.1
7.2
Embodied Carbon, kg CO2/kg material 2.8
14
Embodied Energy, MJ/kg 46
240
Embodied Water, L/kg 330
1140

Common Calculations

Stiffness to Weight: Axial, points 7.2
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 15
2.1
Strength to Weight: Bending, points 16
4.4
Thermal Diffusivity, mm2/s 35
36
Thermal Shock Resistance, points 15
3.3

Alloy Composition

Aluminum (Al), % 0 to 0.1
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 62.7 to 66
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.25 to 0.5
0 to 0.020
Lead (Pb), % 0.8 to 2.2
0 to 0.070
Manganese (Mn), % 0 to 0.15
0
Nickel (Ni), % 0 to 0.8
0 to 0.010
Silicon (Si), % 0.65 to 1.1
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.8
89.9 to 91.5
Zinc (Zn), % 27.9 to 35.6
8.5 to 9.5