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CC752S Brass vs. CR007A Copper

Both CC752S brass and CR007A copper are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 63% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is CC752S brass and the bottom bar is CR007A copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
120
Elongation at Break, % 8.4
15
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 40
43
Tensile Strength: Ultimate (UTS), MPa 350
230
Tensile Strength: Yield (Proof), MPa 190
140

Thermal Properties

Latent Heat of Fusion, J/g 170
210
Maximum Temperature: Mechanical, °C 130
200
Melting Completion (Liquidus), °C 840
1090
Melting Onset (Solidus), °C 800
1040
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 110
380
Thermal Expansion, µm/m-K 21
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 25
100
Electrical Conductivity: Equal Weight (Specific), % IACS 28
100

Otherwise Unclassified Properties

Base Metal Price, % relative 24
31
Density, g/cm3 8.1
9.0
Embodied Carbon, kg CO2/kg material 2.7
2.6
Embodied Energy, MJ/kg 46
41
Embodied Water, L/kg 330
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 25
31
Resilience: Unit (Modulus of Resilience), kJ/m3 180
83
Stiffness to Weight: Axial, points 7.1
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 12
7.1
Strength to Weight: Bending, points 13
9.3
Thermal Diffusivity, mm2/s 35
110
Thermal Shock Resistance, points 12
8.1

Alloy Composition

Aluminum (Al), % 0.3 to 0.7
0
Antimony (Sb), % 0 to 0.14
0 to 0.00040
Arsenic (As), % 0.040 to 0.14
0 to 0.00050
Bismuth (Bi), % 0
0 to 0.00020
Copper (Cu), % 61.5 to 64.5
99.994 to 100
Iron (Fe), % 0 to 0.3
0 to 0.0010
Lead (Pb), % 1.5 to 2.2
0 to 0.00050
Manganese (Mn), % 0 to 0.1
0
Nickel (Ni), % 0 to 0.2
0
Selenium (Se), % 0
0 to 0.00020
Silicon (Si), % 0 to 0.020
0
Silver (Ag), % 0
0 to 0.0025
Sulfur (S), % 0
0 to 0.0015
Tellurium (Te), % 0
0 to 0.00020
Tin (Sn), % 0 to 0.3
0
Zinc (Zn), % 31.5 to 36.7
0