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CC755S Brass vs. Solder Alloy 801

CC755S brass belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is CC755S brass and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 110
22
Elastic (Young's, Tensile) Modulus, GPa 100
53
Elongation at Break, % 9.5
33
Poisson's Ratio 0.31
0.35
Shear Modulus, GPa 40
20
Tensile Strength: Ultimate (UTS), MPa 390
55

Thermal Properties

Latent Heat of Fusion, J/g 170
64
Melting Completion (Liquidus), °C 820
200
Melting Onset (Solidus), °C 780
200
Specific Heat Capacity, J/kg-K 390
240
Thermal Conductivity, W/m-K 120
61
Thermal Expansion, µm/m-K 21
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 27
15
Electrical Conductivity: Equal Weight (Specific), % IACS 30
19

Otherwise Unclassified Properties

Density, g/cm3 8.1
7.2
Embodied Carbon, kg CO2/kg material 2.7
14
Embodied Energy, MJ/kg 46
240
Embodied Water, L/kg 330
1140

Common Calculations

Stiffness to Weight: Axial, points 7.1
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 14
2.1
Strength to Weight: Bending, points 15
4.4
Thermal Diffusivity, mm2/s 38
36
Thermal Shock Resistance, points 13
3.3

Alloy Composition

Aluminum (Al), % 0.4 to 0.7
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 59.5 to 61
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.050 to 0.2
0 to 0.020
Lead (Pb), % 1.2 to 1.7
0 to 0.070
Manganese (Mn), % 0 to 0.050
0
Nickel (Ni), % 0 to 0.2
0 to 0.010
Silicon (Si), % 0 to 0.050
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.3
89.9 to 91.5
Zinc (Zn), % 35.8 to 38.9
8.5 to 9.5