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CC755S Brass vs. C97300 Nickel Silver

Both CC755S brass and C97300 nickel silver are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 78% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is CC755S brass and the bottom bar is C97300 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
110
Elongation at Break, % 9.5
9.0
Poisson's Ratio 0.31
0.33
Shear Modulus, GPa 40
40
Tensile Strength: Ultimate (UTS), MPa 390
230
Tensile Strength: Yield (Proof), MPa 250
110

Thermal Properties

Latent Heat of Fusion, J/g 170
180
Maximum Temperature: Mechanical, °C 120
150
Melting Completion (Liquidus), °C 820
1040
Melting Onset (Solidus), °C 780
1010
Specific Heat Capacity, J/kg-K 390
370
Thermal Conductivity, W/m-K 120
29
Thermal Expansion, µm/m-K 21
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 27
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 30
6.3

Otherwise Unclassified Properties

Base Metal Price, % relative 23
30
Density, g/cm3 8.1
8.6
Embodied Carbon, kg CO2/kg material 2.7
3.7
Embodied Energy, MJ/kg 46
59
Embodied Water, L/kg 330
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 33
18
Resilience: Unit (Modulus of Resilience), kJ/m3 290
59
Stiffness to Weight: Axial, points 7.1
7.0
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 14
7.6
Strength to Weight: Bending, points 15
9.8
Thermal Diffusivity, mm2/s 38
9.3
Thermal Shock Resistance, points 13
8.0

Alloy Composition


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Aluminum (Al), % 0.4 to 0.7
0 to 0.0050
Antimony (Sb), % 0
0 to 0.35
Copper (Cu), % 59.5 to 61
53 to 58
Iron (Fe), % 0.050 to 0.2
0 to 1.5
Lead (Pb), % 1.2 to 1.7
8.0 to 11
Manganese (Mn), % 0 to 0.050
0
Nickel (Ni), % 0 to 0.2
11 to 14
Phosphorus (P), % 0
0 to 0.050
Silicon (Si), % 0 to 0.050
0 to 0.15
Sulfur (S), % 0
0 to 0.080
Tin (Sn), % 0 to 0.3
1.5 to 3.0
Zinc (Zn), % 35.8 to 38.9
17 to 25
Residuals, % 0
0 to 1.0