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CC767S Brass vs. Solder Alloy 123

CC767S brass belongs to the copper alloys classification, while solder alloy 123 belongs to the otherwise unclassified metals. There are 25 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is CC767S brass and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 86
8.0
Elastic (Young's, Tensile) Modulus, GPa 110
18
Elongation at Break, % 34
45
Poisson's Ratio 0.31
0.44
Shear Modulus, GPa 40
6.2
Tensile Strength: Ultimate (UTS), MPa 430
28

Thermal Properties

Latent Heat of Fusion, J/g 180
26
Melting Completion (Liquidus), °C 840
310
Melting Onset (Solidus), °C 790
300
Specific Heat Capacity, J/kg-K 390
130
Thermal Conductivity, W/m-K 110
23
Thermal Expansion, µm/m-K 21
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 32
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 36
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 23
75
Density, g/cm3 8.0
11
Embodied Carbon, kg CO2/kg material 2.7
4.5
Embodied Energy, MJ/kg 47
74
Embodied Water, L/kg 330
500

Common Calculations

Stiffness to Weight: Axial, points 7.3
0.9
Stiffness to Weight: Bending, points 20
7.8
Strength to Weight: Axial, points 15
0.69
Strength to Weight: Bending, points 16
1.8
Thermal Diffusivity, mm2/s 34
16
Thermal Shock Resistance, points 14
3.8

Alloy Composition

Aluminum (Al), % 0.1 to 0.8
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 58 to 64
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.5
0 to 0.020
Lead (Pb), % 0 to 0.1
93.5 to 95.5
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 0 to 1.0
0 to 0.010
Silicon (Si), % 0 to 0.2
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.1
4.5 to 5.5
Zinc (Zn), % 32.8 to 41.9
0 to 0.0010