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CR011A Copper vs. Monel K-500

CR011A copper belongs to the copper alloys classification, while Monel K-500 belongs to the nickel alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is CR011A copper and the bottom bar is Monel K-500.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
160
Elongation at Break, % 15
25 to 36
Poisson's Ratio 0.34
0.32
Shear Modulus, GPa 43
61
Tensile Strength: Ultimate (UTS), MPa 220
640 to 1100
Tensile Strength: Yield (Proof), MPa 130
310 to 880

Thermal Properties

Latent Heat of Fusion, J/g 210
270
Maximum Temperature: Mechanical, °C 200
900
Melting Completion (Liquidus), °C 1090
1350
Melting Onset (Solidus), °C 1040
1320
Specific Heat Capacity, J/kg-K 390
440
Thermal Conductivity, W/m-K 390
18
Thermal Expansion, µm/m-K 17
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
3.1
Electrical Conductivity: Equal Weight (Specific), % IACS 100
3.2

Otherwise Unclassified Properties

Base Metal Price, % relative 32
50
Density, g/cm3 9.0
8.7
Embodied Carbon, kg CO2/kg material 2.6
8.1
Embodied Energy, MJ/kg 42
120
Embodied Water, L/kg 340
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 29
180 to 260
Resilience: Unit (Modulus of Resilience), kJ/m3 76
300 to 2420
Stiffness to Weight: Axial, points 7.2
10
Stiffness to Weight: Bending, points 18
21
Strength to Weight: Axial, points 6.8
21 to 35
Strength to Weight: Bending, points 9.0
19 to 27
Thermal Diffusivity, mm2/s 110
4.8
Thermal Shock Resistance, points 7.8
21 to 36

Alloy Composition

Aluminum (Al), % 0
2.3 to 3.2
Bismuth (Bi), % 0 to 0.00050
0
Carbon (C), % 0
0 to 0.18
Copper (Cu), % 99.88 to 99.97
27 to 33
Iron (Fe), % 0
0 to 2.0
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0
63 to 70.4
Oxygen (O), % 0 to 0.040
0
Silicon (Si), % 0
0 to 0.5
Silver (Ag), % 0.030 to 0.050
0
Sulfur (S), % 0
0 to 0.010
Titanium (Ti), % 0
0.35 to 0.85