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CR011A Copper vs. C85900 Brass

Both CR011A copper and C85900 brass are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 60% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is CR011A copper and the bottom bar is C85900 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
100
Elongation at Break, % 15
30
Poisson's Ratio 0.34
0.31
Shear Modulus, GPa 43
40
Tensile Strength: Ultimate (UTS), MPa 220
460
Tensile Strength: Yield (Proof), MPa 130
190

Thermal Properties

Latent Heat of Fusion, J/g 210
170
Maximum Temperature: Mechanical, °C 200
130
Melting Completion (Liquidus), °C 1090
830
Melting Onset (Solidus), °C 1040
790
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 390
89
Thermal Expansion, µm/m-K 17
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
25
Electrical Conductivity: Equal Weight (Specific), % IACS 100
28

Otherwise Unclassified Properties

Base Metal Price, % relative 32
24
Density, g/cm3 9.0
8.0
Embodied Carbon, kg CO2/kg material 2.6
2.9
Embodied Energy, MJ/kg 42
49
Embodied Water, L/kg 340
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 29
110
Resilience: Unit (Modulus of Resilience), kJ/m3 76
170
Stiffness to Weight: Axial, points 7.2
7.3
Stiffness to Weight: Bending, points 18
20
Strength to Weight: Axial, points 6.8
16
Strength to Weight: Bending, points 9.0
17
Thermal Diffusivity, mm2/s 110
29
Thermal Shock Resistance, points 7.8
16

Alloy Composition


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Aluminum (Al), % 0
0.1 to 0.6
Antimony (Sb), % 0
0 to 0.2
Bismuth (Bi), % 0 to 0.00050
0
Boron (B), % 0
0 to 0.2
Copper (Cu), % 99.88 to 99.97
58 to 62
Iron (Fe), % 0
0 to 0.5
Lead (Pb), % 0
0 to 0.090
Manganese (Mn), % 0
0 to 0.010
Nickel (Ni), % 0
0 to 1.5
Oxygen (O), % 0 to 0.040
0
Phosphorus (P), % 0
0 to 0.010
Silicon (Si), % 0
0 to 0.25
Silver (Ag), % 0.030 to 0.050
0
Sulfur (S), % 0
0.1 to 0.65
Tin (Sn), % 0
0 to 1.5
Zinc (Zn), % 0
31 to 41
Zirconium (Zr), % 0
0 to 0.2
Residuals, % 0
0 to 0.7