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H04 C14510 Copper vs. H04 C72800 Copper-nickel

Both H04 C14510 copper and H04 C72800 copper-nickel are copper alloys. Both are furnished in the H04 (full hard) temper. They have 81% of their average alloy composition in common. There are 27 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is H04 C14510 copper and the bottom bar is H04 C72800 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 9.6
8.7
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
44
Shear Strength, MPa 190
470
Tensile Strength: Ultimate (UTS), MPa 320
790
Tensile Strength: Yield (Proof), MPa 250
760

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 200
200
Melting Completion (Liquidus), °C 1080
1080
Melting Onset (Solidus), °C 1050
920
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 360
55
Thermal Expansion, µm/m-K 17
17

Otherwise Unclassified Properties

Base Metal Price, % relative 33
38
Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 2.6
4.4
Embodied Energy, MJ/kg 42
68
Embodied Water, L/kg 310
360

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 29
68
Resilience: Unit (Modulus of Resilience), kJ/m3 280
2450
Stiffness to Weight: Axial, points 7.2
7.4
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 10
25
Strength to Weight: Bending, points 12
22
Thermal Diffusivity, mm2/s 100
17
Thermal Shock Resistance, points 12
28

Alloy Composition


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Aluminum (Al), % 0
0 to 0.1
Antimony (Sb), % 0
0 to 0.020
Bismuth (Bi), % 0
0 to 0.0010
Boron (B), % 0
0 to 0.0010
Copper (Cu), % 99.15 to 99.69
78.3 to 82.8
Iron (Fe), % 0
0 to 0.5
Lead (Pb), % 0 to 0.050
0 to 0.0050
Magnesium (Mg), % 0
0.0050 to 0.15
Manganese (Mn), % 0
0.050 to 0.3
Nickel (Ni), % 0
9.5 to 10.5
Niobium (Nb), % 0
0.1 to 0.3
Phosphorus (P), % 0.010 to 0.030
0 to 0.0050
Silicon (Si), % 0
0 to 0.050
Sulfur (S), % 0
0 to 0.0025
Tellurium (Te), % 0.3 to 0.7
0
Tin (Sn), % 0
7.5 to 8.5
Titanium (Ti), % 0
0 to 0.010
Zinc (Zn), % 0
0 to 1.0
Residuals, % 0
0 to 0.3