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H04 C18900 Copper vs. H04 C71520 Copper-nickel

Both H04 C18900 copper and H04 C71520 copper-nickel are copper alloys. Both are furnished in the H04 (full hard) temper. They have 69% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is H04 C18900 copper and the bottom bar is H04 C71520 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 14
10
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
51
Shear Strength, MPa 300
340
Tensile Strength: Ultimate (UTS), MPa 500
570
Tensile Strength: Yield (Proof), MPa 390
430

Thermal Properties

Latent Heat of Fusion, J/g 210
230
Maximum Temperature: Mechanical, °C 200
260
Melting Completion (Liquidus), °C 1080
1170
Melting Onset (Solidus), °C 1020
1120
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 130
32
Thermal Expansion, µm/m-K 17
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 30
5.7
Electrical Conductivity: Equal Weight (Specific), % IACS 30
5.8

Otherwise Unclassified Properties

Base Metal Price, % relative 31
40
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.0
Embodied Energy, MJ/kg 42
73
Embodied Water, L/kg 310
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 65
54
Resilience: Unit (Modulus of Resilience), kJ/m3 660
680
Stiffness to Weight: Axial, points 7.2
8.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 16
18
Strength to Weight: Bending, points 16
17
Thermal Diffusivity, mm2/s 38
8.9
Thermal Shock Resistance, points 18
19

Alloy Composition


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Aluminum (Al), % 0 to 0.010
0
Carbon (C), % 0
0 to 0.050
Copper (Cu), % 97.7 to 99.15
65 to 71.6
Iron (Fe), % 0
0.4 to 1.0
Lead (Pb), % 0 to 0.020
0 to 0.020
Manganese (Mn), % 0.1 to 0.3
0 to 1.0
Nickel (Ni), % 0
28 to 33
Phosphorus (P), % 0 to 0.050
0 to 0.2
Silicon (Si), % 0.15 to 0.4
0
Sulfur (S), % 0
0 to 0.020
Tin (Sn), % 0.6 to 0.9
0
Zinc (Zn), % 0 to 0.1
0 to 0.5
Residuals, % 0 to 0.5
0 to 0.5