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H04 C19010 Copper vs. C70250 Copper

Both H04 C19010 copper and C70250 copper are copper alloys. They have a very high 97% of their average alloy composition in common. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is H04 C19010 copper and the bottom bar is C70250 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
44
Tensile Strength: Ultimate (UTS), MPa 500
520 to 740

Thermal Properties

Latent Heat of Fusion, J/g 210
220
Maximum Temperature: Mechanical, °C 200
210
Melting Completion (Liquidus), °C 1060
1100
Melting Onset (Solidus), °C 1010
1080
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 260
170
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 50
36 to 50
Electrical Conductivity: Equal Weight (Specific), % IACS 50
37 to 51

Otherwise Unclassified Properties

Base Metal Price, % relative 31
31
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.7
2.9
Embodied Energy, MJ/kg 42
45
Embodied Water, L/kg 310
310

Common Calculations

Stiffness to Weight: Axial, points 7.3
7.4
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 15
16 to 23
Strength to Weight: Bending, points 16
16 to 21
Thermal Diffusivity, mm2/s 75
49
Thermal Shock Resistance, points 18
18 to 26

Alloy Composition

Copper (Cu), % 97.3 to 99.04
92.7 to 97.5
Lead (Pb), % 0
0 to 0.050
Magnesium (Mg), % 0
0.050 to 0.3
Manganese (Mn), % 0
0 to 0.1
Nickel (Ni), % 0.8 to 1.8
2.2 to 4.2
Phosphorus (P), % 0.010 to 0.050
0
Silicon (Si), % 0.15 to 0.35
0.25 to 1.2
Zinc (Zn), % 0
0 to 1.0
Residuals, % 0
0 to 0.5