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H04 C19500 Copper vs. H04 C49300 Brass

Both H04 C19500 copper and H04 C49300 brass are copper alloys. Both are furnished in the H04 (full hard) temper. They have 61% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is H04 C19500 copper and the bottom bar is H04 C49300 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
100
Elongation at Break, % 10
4.5
Poisson's Ratio 0.34
0.31
Shear Modulus, GPa 44
40
Shear Strength, MPa 350
290
Tensile Strength: Ultimate (UTS), MPa 590
520
Tensile Strength: Yield (Proof), MPa 530
390

Thermal Properties

Latent Heat of Fusion, J/g 210
170
Maximum Temperature: Mechanical, °C 200
120
Melting Completion (Liquidus), °C 1090
880
Melting Onset (Solidus), °C 1090
840
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 200
88
Thermal Expansion, µm/m-K 17
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 50
15
Electrical Conductivity: Equal Weight (Specific), % IACS 51
17

Otherwise Unclassified Properties

Base Metal Price, % relative 31
26
Density, g/cm3 8.9
8.0
Embodied Carbon, kg CO2/kg material 2.7
3.0
Embodied Energy, MJ/kg 42
50
Embodied Water, L/kg 310
370

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
21
Resilience: Unit (Modulus of Resilience), kJ/m3 1210
740
Stiffness to Weight: Axial, points 7.3
7.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 18
18
Strength to Weight: Bending, points 18
18
Thermal Diffusivity, mm2/s 58
29
Thermal Shock Resistance, points 21
18

Alloy Composition


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Aluminum (Al), % 0 to 0.020
0 to 0.5
Antimony (Sb), % 0
0 to 0.5
Bismuth (Bi), % 0
0.5 to 2.0
Cobalt (Co), % 0.3 to 1.3
0
Copper (Cu), % 94.9 to 98.6
58 to 62
Iron (Fe), % 1.0 to 2.0
0 to 0.1
Lead (Pb), % 0 to 0.020
0 to 0.010
Manganese (Mn), % 0
0 to 0.030
Nickel (Ni), % 0
0 to 1.5
Phosphorus (P), % 0.010 to 0.35
0 to 0.2
Selenium (Se), % 0
0 to 0.2
Silicon (Si), % 0
0 to 0.1
Tin (Sn), % 0.1 to 1.0
1.0 to 1.8
Zinc (Zn), % 0 to 0.2
30.6 to 40.5
Residuals, % 0 to 0.2
0 to 0.5