H04 C23400 Brass vs. H04 C72800 Copper-nickel
Both H04 C23400 brass and H04 C72800 copper-nickel are copper alloys. Both are furnished in the H04 (full hard) temper. They have 81% of their average alloy composition in common. There are 27 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.
For each property being compared, the top bar is H04 C23400 brass and the bottom bar is H04 C72800 copper-nickel.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 110 | |
| 120 |
| Elongation at Break, % | 7.5 | |
| 8.7 |
| Poisson's Ratio | 0.32 | |
| 0.34 |
| Shear Modulus, GPa | 42 | |
| 44 |
| Shear Strength, MPa | 290 | |
| 470 |
| Tensile Strength: Ultimate (UTS), MPa | 500 | |
| 790 |
| Tensile Strength: Yield (Proof), MPa | 430 | |
| 760 |
Thermal Properties
| Latent Heat of Fusion, J/g | 190 | |
| 210 |
| Maximum Temperature: Mechanical, °C | 160 | |
| 200 |
| Melting Completion (Liquidus), °C | 970 | |
| 1080 |
| Melting Onset (Solidus), °C | 930 | |
| 920 |
| Specific Heat Capacity, J/kg-K | 390 | |
| 380 |
| Thermal Conductivity, W/m-K | 120 | |
| 55 |
| Thermal Expansion, µm/m-K | 19 | |
| 17 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 27 | |
| 38 |
| Density, g/cm3 | 8.5 | |
| 8.8 |
| Embodied Carbon, kg CO2/kg material | 2.6 | |
| 4.4 |
| Embodied Energy, MJ/kg | 43 | |
| 68 |
| Embodied Water, L/kg | 320 | |
| 360 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 36 | |
| 68 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 830 | |
| 2450 |
| Stiffness to Weight: Axial, points | 7.2 | |
| 7.4 |
| Stiffness to Weight: Bending, points | 19 | |
| 19 |
| Strength to Weight: Axial, points | 16 | |
| 25 |
| Strength to Weight: Bending, points | 16 | |
| 22 |
| Thermal Diffusivity, mm2/s | 36 | |
| 17 |
| Thermal Shock Resistance, points | 17 | |
| 28 |
Alloy Composition
| Aluminum (Al), % | 0 | |
| 0 to 0.1 |
| Antimony (Sb), % | 0 | |
| 0 to 0.020 |
| Bismuth (Bi), % | 0 | |
| 0 to 0.0010 |
| Boron (B), % | 0 | |
| 0 to 0.0010 |
| Copper (Cu), % | 81 to 84 | |
| 78.3 to 82.8 |
| Iron (Fe), % | 0 to 0.050 | |
| 0 to 0.5 |
| Lead (Pb), % | 0 to 0.050 | |
| 0 to 0.0050 |
| Magnesium (Mg), % | 0 | |
| 0.0050 to 0.15 |
| Manganese (Mn), % | 0 | |
| 0.050 to 0.3 |
| Nickel (Ni), % | 0 | |
| 9.5 to 10.5 |
| Niobium (Nb), % | 0 | |
| 0.1 to 0.3 |
| Phosphorus (P), % | 0 | |
| 0 to 0.0050 |
| Silicon (Si), % | 0 | |
| 0 to 0.050 |
| Sulfur (S), % | 0 | |
| 0 to 0.0025 |
| Tin (Sn), % | 0 | |
| 7.5 to 8.5 |
| Titanium (Ti), % | 0 | |
| 0 to 0.010 |
| Zinc (Zn), % | 15.7 to 19 | |
| 0 to 1.0 |
| Residuals, % | 0 | |
| 0 to 0.3 |