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H04 C26000 Brass vs. H04 C49300 Brass

Both H04 C26000 brass and H04 C49300 brass are copper alloys. Both are furnished in the H04 (full hard) temper. They have 90% of their average alloy composition in common. There are 30 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is H04 C26000 brass and the bottom bar is H04 C49300 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
100
Elongation at Break, % 8.0
4.5
Fatigue Strength, MPa 150
200
Poisson's Ratio 0.31
0.31
Shear Modulus, GPa 41
40
Shear Strength, MPa 310
290
Tensile Strength: Ultimate (UTS), MPa 520
520
Tensile Strength: Yield (Proof), MPa 440
390

Thermal Properties

Latent Heat of Fusion, J/g 180
170
Maximum Temperature: Mechanical, °C 140
120
Melting Completion (Liquidus), °C 950
880
Melting Onset (Solidus), °C 920
840
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 120
88
Thermal Expansion, µm/m-K 20
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 28
15
Electrical Conductivity: Equal Weight (Specific), % IACS 31
17

Otherwise Unclassified Properties

Base Metal Price, % relative 25
26
Density, g/cm3 8.2
8.0
Embodied Carbon, kg CO2/kg material 2.7
3.0
Embodied Energy, MJ/kg 45
50
Embodied Water, L/kg 320
370

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 39
21
Resilience: Unit (Modulus of Resilience), kJ/m3 880
740
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 18
18
Strength to Weight: Bending, points 17
18
Thermal Diffusivity, mm2/s 38
29
Thermal Shock Resistance, points 17
18

Alloy Composition


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Aluminum (Al), % 0
0 to 0.5
Antimony (Sb), % 0
0 to 0.5
Bismuth (Bi), % 0 to 0.0059
0.5 to 2.0
Copper (Cu), % 68.5 to 71.5
58 to 62
Iron (Fe), % 0 to 0.050
0 to 0.1
Lead (Pb), % 0 to 0.070
0 to 0.010
Manganese (Mn), % 0
0 to 0.030
Nickel (Ni), % 0
0 to 1.5
Phosphorus (P), % 0
0 to 0.2
Selenium (Se), % 0
0 to 0.2
Silicon (Si), % 0
0 to 0.1
Tin (Sn), % 0
1.0 to 1.8
Zinc (Zn), % 28.1 to 31.5
30.6 to 40.5
Residuals, % 0 to 0.3
0 to 0.5