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H04 C49300 Brass vs. H04 C66700 Brass

Both H04 C49300 brass and H04 C66700 brass are copper alloys. Both are furnished in the H04 (full hard) temper. They have 89% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is H04 C49300 brass and the bottom bar is H04 C66700 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
110
Elongation at Break, % 4.5
10
Poisson's Ratio 0.31
0.31
Shear Modulus, GPa 40
41
Shear Strength, MPa 290
320
Tensile Strength: Ultimate (UTS), MPa 520
540
Tensile Strength: Yield (Proof), MPa 390
490

Thermal Properties

Latent Heat of Fusion, J/g 170
180
Maximum Temperature: Mechanical, °C 120
140
Melting Completion (Liquidus), °C 880
1090
Melting Onset (Solidus), °C 840
1050
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 88
97
Thermal Expansion, µm/m-K 20
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
17
Electrical Conductivity: Equal Weight (Specific), % IACS 17
19

Otherwise Unclassified Properties

Base Metal Price, % relative 26
25
Density, g/cm3 8.0
8.2
Embodied Carbon, kg CO2/kg material 3.0
2.7
Embodied Energy, MJ/kg 50
45
Embodied Water, L/kg 370
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 21
52
Resilience: Unit (Modulus of Resilience), kJ/m3 740
1090
Stiffness to Weight: Axial, points 7.2
7.3
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 18
18
Strength to Weight: Bending, points 18
18
Thermal Diffusivity, mm2/s 29
30
Thermal Shock Resistance, points 18
18

Alloy Composition


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Aluminum (Al), % 0 to 0.5
0
Antimony (Sb), % 0 to 0.5
0
Bismuth (Bi), % 0.5 to 2.0
0
Copper (Cu), % 58 to 62
68.5 to 71.5
Iron (Fe), % 0 to 0.1
0 to 0.1
Lead (Pb), % 0 to 0.010
0 to 0.070
Manganese (Mn), % 0 to 0.030
0.8 to 1.5
Nickel (Ni), % 0 to 1.5
0
Phosphorus (P), % 0 to 0.2
0
Selenium (Se), % 0 to 0.2
0
Silicon (Si), % 0 to 0.1
0
Tin (Sn), % 1.0 to 1.8
0
Zinc (Zn), % 30.6 to 40.5
26.3 to 30.7
Residuals, % 0 to 0.5
0 to 0.5