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H04 C49300 Brass vs. H04 C71500 Copper-nickel

Both H04 C49300 brass and H04 C71500 copper-nickel are copper alloys. Both are furnished in the H04 (full hard) temper. They have 62% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is H04 C49300 brass and the bottom bar is H04 C71500 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
140
Elongation at Break, % 4.5
10
Poisson's Ratio 0.31
0.33
Shear Modulus, GPa 40
52
Shear Strength, MPa 290
340
Tensile Strength: Ultimate (UTS), MPa 520
570
Tensile Strength: Yield (Proof), MPa 390
430

Thermal Properties

Latent Heat of Fusion, J/g 170
230
Maximum Temperature: Mechanical, °C 120
260
Melting Completion (Liquidus), °C 880
1240
Melting Onset (Solidus), °C 840
1170
Specific Heat Capacity, J/kg-K 380
400
Thermal Conductivity, W/m-K 88
28
Thermal Expansion, µm/m-K 20
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
4.6
Electrical Conductivity: Equal Weight (Specific), % IACS 17
4.7

Otherwise Unclassified Properties

Base Metal Price, % relative 26
41
Density, g/cm3 8.0
8.9
Embodied Carbon, kg CO2/kg material 3.0
5.1
Embodied Energy, MJ/kg 50
74
Embodied Water, L/kg 370
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 21
54
Resilience: Unit (Modulus of Resilience), kJ/m3 740
680
Stiffness to Weight: Axial, points 7.2
8.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 18
18
Strength to Weight: Bending, points 18
17
Thermal Diffusivity, mm2/s 29
7.7
Thermal Shock Resistance, points 18
18

Alloy Composition


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Aluminum (Al), % 0 to 0.5
0
Antimony (Sb), % 0 to 0.5
0
Bismuth (Bi), % 0.5 to 2.0
0
Copper (Cu), % 58 to 62
63.5 to 70.6
Iron (Fe), % 0 to 0.1
0.4 to 1.0
Lead (Pb), % 0 to 0.010
0 to 0.050
Manganese (Mn), % 0 to 0.030
0 to 1.0
Nickel (Ni), % 0 to 1.5
29 to 33
Phosphorus (P), % 0 to 0.2
0
Selenium (Se), % 0 to 0.2
0
Silicon (Si), % 0 to 0.1
0
Tin (Sn), % 1.0 to 1.8
0
Zinc (Zn), % 30.6 to 40.5
0 to 1.0
Residuals, % 0 to 0.5
0 to 0.5