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H04 C49300 Brass vs. H04 C72800 Copper-nickel

Both H04 C49300 brass and H04 C72800 copper-nickel are copper alloys. Both are furnished in the H04 (full hard) temper. They have 63% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is H04 C49300 brass and the bottom bar is H04 C72800 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
120
Elongation at Break, % 4.5
8.7
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 40
44
Shear Strength, MPa 290
470
Tensile Strength: Ultimate (UTS), MPa 520
790
Tensile Strength: Yield (Proof), MPa 390
760

Thermal Properties

Latent Heat of Fusion, J/g 170
210
Maximum Temperature: Mechanical, °C 120
200
Melting Completion (Liquidus), °C 880
1080
Melting Onset (Solidus), °C 840
920
Specific Heat Capacity, J/kg-K 380
380
Thermal Conductivity, W/m-K 88
55
Thermal Expansion, µm/m-K 20
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
11
Electrical Conductivity: Equal Weight (Specific), % IACS 17
11

Otherwise Unclassified Properties

Base Metal Price, % relative 26
38
Density, g/cm3 8.0
8.8
Embodied Carbon, kg CO2/kg material 3.0
4.4
Embodied Energy, MJ/kg 50
68
Embodied Water, L/kg 370
360

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 21
68
Resilience: Unit (Modulus of Resilience), kJ/m3 740
2450
Stiffness to Weight: Axial, points 7.2
7.4
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 18
25
Strength to Weight: Bending, points 18
22
Thermal Diffusivity, mm2/s 29
17
Thermal Shock Resistance, points 18
28

Alloy Composition


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Aluminum (Al), % 0 to 0.5
0 to 0.1
Antimony (Sb), % 0 to 0.5
0 to 0.020
Bismuth (Bi), % 0.5 to 2.0
0 to 0.0010
Boron (B), % 0
0 to 0.0010
Copper (Cu), % 58 to 62
78.3 to 82.8
Iron (Fe), % 0 to 0.1
0 to 0.5
Lead (Pb), % 0 to 0.010
0 to 0.0050
Magnesium (Mg), % 0
0.0050 to 0.15
Manganese (Mn), % 0 to 0.030
0.050 to 0.3
Nickel (Ni), % 0 to 1.5
9.5 to 10.5
Niobium (Nb), % 0
0.1 to 0.3
Phosphorus (P), % 0 to 0.2
0 to 0.0050
Selenium (Se), % 0 to 0.2
0
Silicon (Si), % 0 to 0.1
0 to 0.050
Sulfur (S), % 0
0 to 0.0025
Tin (Sn), % 1.0 to 1.8
7.5 to 8.5
Titanium (Ti), % 0
0 to 0.010
Zinc (Zn), % 30.6 to 40.5
0 to 1.0
Residuals, % 0 to 0.5
0 to 0.3