H04 C49300 Brass vs. H04 C73500 Nickel Silver
Both H04 C49300 brass and H04 C73500 nickel silver are copper alloys. Both are furnished in the H04 (full hard) temper. They have 70% of their average alloy composition in common. There are 24 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.
For each property being compared, the top bar is H04 C49300 brass and the bottom bar is H04 C73500 nickel silver.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 100 | |
| 130 |
| Poisson's Ratio | 0.31 | |
| 0.33 |
| Shear Modulus, GPa | 40 | |
| 47 |
| Tensile Strength: Ultimate (UTS), MPa | 520 | |
| 540 |
Thermal Properties
| Latent Heat of Fusion, J/g | 170 | |
| 210 |
| Maximum Temperature: Mechanical, °C | 120 | |
| 220 |
| Melting Completion (Liquidus), °C | 880 | |
| 1140 |
| Melting Onset (Solidus), °C | 840 | |
| 1090 |
| Specific Heat Capacity, J/kg-K | 380 | |
| 400 |
| Thermal Conductivity, W/m-K | 88 | |
| 36 |
| Thermal Expansion, µm/m-K | 20 | |
| 17 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 15 | |
| 6.5 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 17 | |
| 6.7 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 26 | |
| 35 |
| Density, g/cm3 | 8.0 | |
| 8.7 |
| Embodied Carbon, kg CO2/kg material | 3.0 | |
| 4.0 |
| Embodied Energy, MJ/kg | 50 | |
| 61 |
| Embodied Water, L/kg | 370 | |
| 300 |
Common Calculations
| Stiffness to Weight: Axial, points | 7.2 | |
| 8.0 |
| Stiffness to Weight: Bending, points | 19 | |
| 19 |
| Strength to Weight: Axial, points | 18 | |
| 17 |
| Strength to Weight: Bending, points | 18 | |
| 17 |
| Thermal Diffusivity, mm2/s | 29 | |
| 10 |
| Thermal Shock Resistance, points | 18 | |
| 18 |
Alloy Composition
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| Aluminum (Al), % | 0 to 0.5 | |
| 0 |
| Antimony (Sb), % | 0 to 0.5 | |
| 0 |
| Bismuth (Bi), % | 0.5 to 2.0 | |
| 0 |
| Copper (Cu), % | 58 to 62 | |
| 70.5 to 73.5 |
| Iron (Fe), % | 0 to 0.1 | |
| 0 to 0.25 |
| Lead (Pb), % | 0 to 0.010 | |
| 0 to 0.1 |
| Manganese (Mn), % | 0 to 0.030 | |
| 0 to 0.5 |
| Nickel (Ni), % | 0 to 1.5 | |
| 16.5 to 19.5 |
| Phosphorus (P), % | 0 to 0.2 | |
| 0 |
| Selenium (Se), % | 0 to 0.2 | |
| 0 |
| Silicon (Si), % | 0 to 0.1 | |
| 0 |
| Tin (Sn), % | 1.0 to 1.8 | |
| 0 |
| Zinc (Zn), % | 30.6 to 40.5 | |
| 5.7 to 13 |
| Residuals, % | 0 to 0.5 | |
| 0 to 0.5 |