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TD04 C17500 Copper vs. TD04 C18200 Copper

Both TD04 C17500 copper and TD04 C18200 copper are copper alloys. Both are furnished in the TD04 (solution heat treated and cold worked to full-hard) temper. They have a very high 97% of their average alloy composition in common. There are 30 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is TD04 C17500 copper and the bottom bar is TD04 C18200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 6.0
11
Poisson's Ratio 0.34
0.34
Rockwell B Hardness 77
65
Shear Modulus, GPa 45
44
Shear Strength, MPa 300
240
Tensile Strength: Ultimate (UTS), MPa 520
400
Tensile Strength: Yield (Proof), MPa 470
390

Thermal Properties

Latent Heat of Fusion, J/g 220
210
Maximum Temperature: Mechanical, °C 220
200
Melting Completion (Liquidus), °C 1060
1080
Melting Onset (Solidus), °C 1020
1070
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 200
320
Thermal Expansion, µm/m-K 18
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 24
80
Electrical Conductivity: Equal Weight (Specific), % IACS 24
81

Otherwise Unclassified Properties

Base Metal Price, % relative 60
31
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 4.7
2.6
Embodied Energy, MJ/kg 73
41
Embodied Water, L/kg 320
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 30
43
Resilience: Unit (Modulus of Resilience), kJ/m3 910
630
Stiffness to Weight: Axial, points 7.5
7.3
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 16
12
Strength to Weight: Bending, points 16
13
Thermal Diffusivity, mm2/s 59
93
Thermal Shock Resistance, points 18
14

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 0.4 to 0.7
0
Chromium (Cr), % 0
0.6 to 1.2
Cobalt (Co), % 2.4 to 2.7
0
Copper (Cu), % 95.6 to 97.2
98.6 to 99.4
Iron (Fe), % 0 to 0.1
0 to 0.1
Lead (Pb), % 0
0 to 0.050
Silicon (Si), % 0 to 0.2
0 to 0.1
Residuals, % 0 to 0.5
0