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TH04 C17500 Copper vs. TH04 C18200 Copper

Both TH04 C17500 copper and TH04 C18200 copper are copper alloys. Both are furnished in the TH04 (full-hard and precipitation heat treated) temper. They have a very high 97% of their average alloy composition in common. There are 30 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is TH04 C17500 copper and the bottom bar is TH04 C18200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 13
16
Poisson's Ratio 0.34
0.34
Rockwell B Hardness 99
82
Shear Modulus, GPa 45
44
Shear Strength, MPa 520
320
Tensile Strength: Ultimate (UTS), MPa 860
530
Tensile Strength: Yield (Proof), MPa 760
450

Thermal Properties

Latent Heat of Fusion, J/g 220
210
Maximum Temperature: Mechanical, °C 220
200
Melting Completion (Liquidus), °C 1060
1080
Melting Onset (Solidus), °C 1020
1070
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 200
320
Thermal Expansion, µm/m-K 18
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 53
80
Electrical Conductivity: Equal Weight (Specific), % IACS 54
81

Otherwise Unclassified Properties

Base Metal Price, % relative 60
31
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 4.7
2.6
Embodied Energy, MJ/kg 73
41
Embodied Water, L/kg 320
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
81
Resilience: Unit (Modulus of Resilience), kJ/m3 2390
860
Stiffness to Weight: Axial, points 7.5
7.3
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 27
16
Strength to Weight: Bending, points 23
16
Thermal Diffusivity, mm2/s 59
93
Thermal Shock Resistance, points 29
18

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 0.4 to 0.7
0
Chromium (Cr), % 0
0.6 to 1.2
Cobalt (Co), % 2.4 to 2.7
0
Copper (Cu), % 95.6 to 97.2
98.6 to 99.4
Iron (Fe), % 0 to 0.1
0 to 0.1
Lead (Pb), % 0
0 to 0.050
Silicon (Si), % 0 to 0.2
0 to 0.1
Residuals, % 0 to 0.5
0