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Grade 1 Babbitt Metal vs. Solder Alloy 301

Both grade 1 Babbitt Metal and solder alloy 301 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 42% of their average alloy composition in common. There are 21 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is grade 1 Babbitt Metal and the bottom bar is solder alloy 301.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 13
23
Elastic (Young's, Tensile) Modulus, GPa 53
40
Elongation at Break, % 34
51
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
15
Tensile Strength: Yield (Proof), MPa 30
49

Thermal Properties

Latent Heat of Fusion, J/g 70
55
Melting Completion (Liquidus), °C 370
140
Melting Onset (Solidus), °C 220
140
Specific Heat Capacity, J/kg-K 230
160
Thermal Conductivity, W/m-K 45
19
Thermal Expansion, µm/m-K 21
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 13
4.7
Electrical Conductivity: Equal Weight (Specific), % IACS 16
4.9

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.7
Embodied Carbon, kg CO2/kg material 12
13
Embodied Energy, MJ/kg 200
210

Common Calculations

Resilience: Unit (Modulus of Resilience), kJ/m3 8.6
30
Stiffness to Weight: Axial, points 4.0
2.5
Stiffness to Weight: Bending, points 17
13
Thermal Diffusivity, mm2/s 26
13

Alloy Composition

Aluminum (Al), % 0 to 0.0050
0 to 0.0010
Antimony (Sb), % 4.0 to 5.0
0 to 0.1
Arsenic (As), % 0 to 0.1
0 to 0.030
Bismuth (Bi), % 0 to 0.080
56.5 to 59
Cadmium (Cd), % 0 to 0.050
0 to 0.0020
Copper (Cu), % 4.0 to 5.0
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.080
0 to 0.020
Lead (Pb), % 0 to 0.35
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 89.3 to 92
41 to 43
Zinc (Zn), % 0 to 0.0050
0 to 0.0010