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Grade CW6MC Nickel vs. C70600 Copper-nickel

Grade CW6MC nickel belongs to the nickel alloys classification, while C70600 copper-nickel belongs to the copper alloys. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is grade CW6MC nickel and the bottom bar is C70600 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 200
120
Elongation at Break, % 28
3.0 to 34
Poisson's Ratio 0.29
0.34
Shear Modulus, GPa 79
46
Tensile Strength: Ultimate (UTS), MPa 540
290 to 570
Tensile Strength: Yield (Proof), MPa 310
63 to 270

Thermal Properties

Latent Heat of Fusion, J/g 330
220
Maximum Temperature: Mechanical, °C 980
220
Melting Completion (Liquidus), °C 1480
1150
Melting Onset (Solidus), °C 1430
1100
Specific Heat Capacity, J/kg-K 440
390
Thermal Conductivity, W/m-K 11
44
Thermal Expansion, µm/m-K 12
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.3
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 1.4
9.9

Otherwise Unclassified Properties

Base Metal Price, % relative 80
33
Density, g/cm3 8.6
8.9
Embodied Carbon, kg CO2/kg material 14
3.4
Embodied Energy, MJ/kg 200
51
Embodied Water, L/kg 290
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 130
6.5 to 160
Resilience: Unit (Modulus of Resilience), kJ/m3 240
16 to 290
Stiffness to Weight: Axial, points 13
7.7
Stiffness to Weight: Bending, points 23
19
Strength to Weight: Axial, points 18
9.1 to 18
Strength to Weight: Bending, points 17
11 to 17
Thermal Diffusivity, mm2/s 2.8
13
Thermal Shock Resistance, points 15
9.8 to 19

Alloy Composition


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Carbon (C), % 0 to 0.060
0
Chromium (Cr), % 20 to 23
0
Copper (Cu), % 0
84.7 to 90
Iron (Fe), % 0 to 5.0
1.0 to 1.8
Lead (Pb), % 0
0 to 0.050
Manganese (Mn), % 0 to 1.0
0 to 1.0
Molybdenum (Mo), % 8.0 to 10
0
Nickel (Ni), % 55.4 to 68.9
9.0 to 11
Niobium (Nb), % 3.2 to 4.5
0
Phosphorus (P), % 0 to 0.015
0
Silicon (Si), % 0 to 1.0
0
Sulfur (S), % 0 to 0.030
0
Zinc (Zn), % 0
0 to 1.0
Residuals, % 0
0 to 0.5