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Grade CY40 Nickel vs. Solder Alloy 191

Grade CY40 nickel belongs to the nickel alloys classification, while solder alloy 191 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is grade CY40 nickel and the bottom bar is solder alloy 191.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 190
19
Elongation at Break, % 34
32
Poisson's Ratio 0.29
0.43
Shear Modulus, GPa 74
6.5
Tensile Strength: Ultimate (UTS), MPa 540
29

Thermal Properties

Latent Heat of Fusion, J/g 330
27
Melting Completion (Liquidus), °C 1350
300
Melting Onset (Solidus), °C 1300
300
Specific Heat Capacity, J/kg-K 470
130
Thermal Conductivity, W/m-K 14
24
Thermal Expansion, µm/m-K 12
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.7
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 1.8
7.2

Otherwise Unclassified Properties

Density, g/cm3 8.4
11
Embodied Carbon, kg CO2/kg material 9.1
5.8
Embodied Energy, MJ/kg 130
95

Common Calculations

Stiffness to Weight: Axial, points 13
0.93
Stiffness to Weight: Bending, points 23
8.0
Strength to Weight: Axial, points 18
0.72
Strength to Weight: Bending, points 18
1.9
Thermal Diffusivity, mm2/s 3.7
16
Thermal Shock Resistance, points 16
3.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.4
0
Chromium (Cr), % 14 to 17
0
Copper (Cu), % 0
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 11
0 to 0.020
Lead (Pb), % 0
92.4 to 94
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 67 to 86
0 to 0.010
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 0 to 3.0
0
Silver (Ag), % 0
1.2 to 1.8
Sulfur (S), % 0 to 0.030
0
Tin (Sn), % 0
4.8 to 5.2
Zinc (Zn), % 0
0 to 0.0010