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Grade CY40 Nickel vs. Solder Alloy 801

Grade CY40 nickel belongs to the nickel alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is grade CY40 nickel and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 190
53
Elongation at Break, % 34
33
Poisson's Ratio 0.29
0.35
Shear Modulus, GPa 74
20
Tensile Strength: Ultimate (UTS), MPa 540
55

Thermal Properties

Latent Heat of Fusion, J/g 330
64
Melting Completion (Liquidus), °C 1350
200
Melting Onset (Solidus), °C 1300
200
Specific Heat Capacity, J/kg-K 470
240
Thermal Conductivity, W/m-K 14
61
Thermal Expansion, µm/m-K 12
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.7
15
Electrical Conductivity: Equal Weight (Specific), % IACS 1.8
19

Otherwise Unclassified Properties

Density, g/cm3 8.4
7.2
Embodied Carbon, kg CO2/kg material 9.1
14
Embodied Energy, MJ/kg 130
240
Embodied Water, L/kg 260
1140

Common Calculations

Stiffness to Weight: Axial, points 13
4.1
Stiffness to Weight: Bending, points 23
17
Strength to Weight: Axial, points 18
2.1
Strength to Weight: Bending, points 18
4.4
Thermal Diffusivity, mm2/s 3.7
36
Thermal Shock Resistance, points 16
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.4
0
Chromium (Cr), % 14 to 17
0
Copper (Cu), % 0
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 11
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 67 to 86
0 to 0.010
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 0 to 3.0
0
Silver (Ag), % 0
0 to 0.1
Sulfur (S), % 0 to 0.030
0
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 0
8.5 to 9.5