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Grade CZ100 Nickel vs. C17500 Copper

Grade CZ100 nickel belongs to the nickel alloys classification, while C17500 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is grade CZ100 nickel and the bottom bar is C17500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 180
120
Elongation at Break, % 11
6.0 to 30
Fatigue Strength, MPa 68
170 to 310
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 69
45
Tensile Strength: Ultimate (UTS), MPa 390
310 to 860
Tensile Strength: Yield (Proof), MPa 140
170 to 760

Thermal Properties

Latent Heat of Fusion, J/g 310
220
Maximum Temperature: Mechanical, °C 900
220
Melting Completion (Liquidus), °C 1350
1060
Melting Onset (Solidus), °C 1300
1020
Specific Heat Capacity, J/kg-K 450
390
Thermal Conductivity, W/m-K 73
200
Thermal Expansion, µm/m-K 11
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 19
24 to 53
Electrical Conductivity: Equal Weight (Specific), % IACS 19
24 to 54

Otherwise Unclassified Properties

Base Metal Price, % relative 60
60
Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 10
4.7
Embodied Energy, MJ/kg 140
73
Embodied Water, L/kg 230
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 35
30 to 120
Resilience: Unit (Modulus of Resilience), kJ/m3 54
120 to 2390
Stiffness to Weight: Axial, points 12
7.5
Stiffness to Weight: Bending, points 22
18
Strength to Weight: Axial, points 12
9.7 to 27
Strength to Weight: Bending, points 14
11 to 23
Thermal Diffusivity, mm2/s 19
59
Thermal Shock Resistance, points 14
11 to 29

Alloy Composition


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Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
0.4 to 0.7
Carbon (C), % 0 to 1.0
0
Cobalt (Co), % 0
2.4 to 2.7
Copper (Cu), % 0 to 1.3
95.6 to 97.2
Iron (Fe), % 0 to 3.0
0 to 0.1
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 95 to 100
0
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 0 to 2.0
0 to 0.2
Sulfur (S), % 0 to 0.030
0
Residuals, % 0
0 to 0.5