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Grade M30C Nickel vs. C14500 Copper

Grade M30C nickel belongs to the nickel alloys classification, while C14500 copper belongs to the copper alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is grade M30C nickel and the bottom bar is C14500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
120
Elongation at Break, % 29
12 to 50
Poisson's Ratio 0.32
0.34
Shear Modulus, GPa 61
43
Tensile Strength: Ultimate (UTS), MPa 510
220 to 330
Tensile Strength: Yield (Proof), MPa 250
69 to 260

Thermal Properties

Latent Heat of Fusion, J/g 290
210
Maximum Temperature: Mechanical, °C 900
200
Melting Completion (Liquidus), °C 1290
1080
Melting Onset (Solidus), °C 1240
1050
Specific Heat Capacity, J/kg-K 430
390
Thermal Conductivity, W/m-K 22
360
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
94
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
95

Otherwise Unclassified Properties

Base Metal Price, % relative 60
33
Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 9.5
2.6
Embodied Energy, MJ/kg 140
42
Embodied Water, L/kg 250
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 120
36 to 85
Resilience: Unit (Modulus of Resilience), kJ/m3 200
21 to 300
Stiffness to Weight: Axial, points 10
7.2
Stiffness to Weight: Bending, points 21
18
Strength to Weight: Axial, points 16
6.8 to 10
Strength to Weight: Bending, points 16
9.1 to 12
Thermal Diffusivity, mm2/s 5.7
100
Thermal Shock Resistance, points 18
8.0 to 12

Alloy Composition

Carbon (C), % 0 to 0.3
0
Copper (Cu), % 26 to 33
99.2 to 99.596
Iron (Fe), % 0 to 3.5
0
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 56.6 to 72
0
Niobium (Nb), % 1.0 to 3.0
0
Phosphorus (P), % 0 to 0.030
0.0040 to 0.012
Silicon (Si), % 1.0 to 2.0
0
Sulfur (S), % 0 to 0.030
0
Tellurium (Te), % 0
0.4 to 0.7