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Grade M30C Nickel vs. C16500 Copper

Grade M30C nickel belongs to the nickel alloys classification, while C16500 copper belongs to the copper alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is grade M30C nickel and the bottom bar is C16500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
110
Elongation at Break, % 29
1.5 to 53
Poisson's Ratio 0.32
0.34
Shear Modulus, GPa 61
43
Tensile Strength: Ultimate (UTS), MPa 510
280 to 530
Tensile Strength: Yield (Proof), MPa 250
97 to 520

Thermal Properties

Latent Heat of Fusion, J/g 290
210
Maximum Temperature: Mechanical, °C 900
340
Melting Completion (Liquidus), °C 1290
1070
Melting Onset (Solidus), °C 1240
1010
Specific Heat Capacity, J/kg-K 430
380
Thermal Conductivity, W/m-K 22
250
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
60
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
61

Otherwise Unclassified Properties

Base Metal Price, % relative 60
31
Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 9.5
2.6
Embodied Energy, MJ/kg 140
42
Embodied Water, L/kg 250
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 120
7.8 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 200
41 to 1160
Stiffness to Weight: Axial, points 10
7.1
Stiffness to Weight: Bending, points 21
18
Strength to Weight: Axial, points 16
8.6 to 17
Strength to Weight: Bending, points 16
11 to 16
Thermal Diffusivity, mm2/s 5.7
74
Thermal Shock Resistance, points 18
9.8 to 19

Alloy Composition


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Cadmium (Cd), % 0
0.6 to 1.0
Carbon (C), % 0 to 0.3
0
Copper (Cu), % 26 to 33
97.8 to 98.9
Iron (Fe), % 0 to 3.5
0 to 0.020
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 56.6 to 72
0
Niobium (Nb), % 1.0 to 3.0
0
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 1.0 to 2.0
0
Sulfur (S), % 0 to 0.030
0
Tin (Sn), % 0
0.5 to 0.7
Residuals, % 0
0 to 0.5