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Grade M30C Nickel vs. C48500 Brass

Grade M30C nickel belongs to the nickel alloys classification, while C48500 brass belongs to the copper alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is grade M30C nickel and the bottom bar is C48500 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
100
Elongation at Break, % 29
13 to 40
Poisson's Ratio 0.32
0.31
Shear Modulus, GPa 61
39
Tensile Strength: Ultimate (UTS), MPa 510
400 to 500
Tensile Strength: Yield (Proof), MPa 250
160 to 320

Thermal Properties

Latent Heat of Fusion, J/g 290
170
Maximum Temperature: Mechanical, °C 900
120
Melting Completion (Liquidus), °C 1290
900
Melting Onset (Solidus), °C 1240
890
Specific Heat Capacity, J/kg-K 430
380
Thermal Conductivity, W/m-K 22
120
Thermal Expansion, µm/m-K 13
21

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
26
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
29

Otherwise Unclassified Properties

Base Metal Price, % relative 60
23
Density, g/cm3 8.8
8.1
Embodied Carbon, kg CO2/kg material 9.5
2.7
Embodied Energy, MJ/kg 140
46
Embodied Water, L/kg 250
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 120
56 to 140
Resilience: Unit (Modulus of Resilience), kJ/m3 200
120 to 500
Stiffness to Weight: Axial, points 10
7.1
Stiffness to Weight: Bending, points 21
19
Strength to Weight: Axial, points 16
14 to 17
Strength to Weight: Bending, points 16
15 to 17
Thermal Diffusivity, mm2/s 5.7
38
Thermal Shock Resistance, points 18
13 to 17

Alloy Composition


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Carbon (C), % 0 to 0.3
0
Copper (Cu), % 26 to 33
59 to 62
Iron (Fe), % 0 to 3.5
0 to 0.1
Lead (Pb), % 0
1.3 to 2.2
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 56.6 to 72
0
Niobium (Nb), % 1.0 to 3.0
0
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 1.0 to 2.0
0
Sulfur (S), % 0 to 0.030
0
Tin (Sn), % 0
0.5 to 1.0
Zinc (Zn), % 0
34.3 to 39.2
Residuals, % 0
0 to 0.4